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dc.contributor.authorAgarwal, Anu
dc.contributor.authorYadav, Anupama
dc.contributor.authorRichardson, Kathleen
dc.contributor.authorLuzinov, Igor
dc.contributor.authorKita, Derek M.
dc.contributor.authorLin, Hongtao
dc.contributor.authorGu, Tian
dc.contributor.authorHu, Juejun
dc.date.accessioned2017-10-31T15:42:36Z
dc.date.available2017-10-31T15:42:36Z
dc.date.issued2017-05
dc.identifier.urihttp://hdl.handle.net/1721.1/112098
dc.description.abstractInfrared (IR) spectroscopy is widely recognized as a gold standard technique for chemical and biological analysis. Traditional IR spectroscopy relies on fragile bench-top instruments located in dedicated laboratory settings, and is thus not suitable for emerging field-deployed applications such as in-line industrial process control, environmental monitoring, and point-of-care diagnosis. Recent strides in photonic integration technologies provide a promising route towards enabling miniaturized, rugged platforms for IR spectroscopic analysis. It is therefore attempting to simply replace the bulky discrete optical elements used in conventional IR spectroscopy with their on-chip counterparts. This size down-scaling approach, however, cripples the system performance as both the sensitivity of spectroscopic sensors and spectral resolution of spectrometers scale with optical path length. In light of this challenge, we will discuss two novel photonic device designs uniquely capable of reaping performance benefits from microphotonic scaling. We leverage strong optical and thermal confinement in judiciously designed micro-cavities to circumvent the thermal diffusion and optical diffraction limits in conventional photothermal sensors and achieve a record 104 photothermal sensitivity enhancement. In the second example, an on-chip spectrometer design with the Fellgett's advantage is analyzed. The design enables sub-nm spectral resolution on a millimeter-sized, fully packaged chip without moving parts.en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Award 1506605)en_US
dc.description.sponsorshipUnited States. Department of Energy (Grant DE-NA0002509)en_US
dc.publisherSPIEen_US
dc.relation.isversionofhttp://dx.doi.org/10.1117/12.2250237en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceSPIEen_US
dc.titleOn-chip infrared sensors: redefining the benefits of scalingen_US
dc.typeArticleen_US
dc.identifier.citationKita, Derek et al. “On-Chip Infrared Sensors: Redefining the Benefits of Scaling.” Proceedings of SPIE, Frontiers in Biological Detection: From Nanosensors to Systems, January 28 - February 2 2017, San Francisco, California, USA, edited by Amos Danielli, et al., SPIE, May 2017 © 2017 SPIEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.mitauthorKita, Derek M.
dc.contributor.mitauthorLin, Hongtao
dc.contributor.mitauthorGu, Tian
dc.contributor.mitauthorHu, Juejun
dc.relation.journalProceedings of SPIE, Frontiers in Biological Detection: From Nanosensors to Systems IXen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2017-10-11T14:43:11Z
dspace.orderedauthorsKita, Derek; Lin, Hongtao; Agarwal, Anu; Yadav, Anupama; Richardson, Kathleen; Luzinov, Igor; Gu, Tian; Hu, Juejunen_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0003-0740-1344
dc.identifier.orcidhttps://orcid.org/0000-0002-7233-3918
mit.licensePUBLISHER_POLICYen_US


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