Verified lifting of stencil computations
Author(s)
Kamil, Shoaib; Cheung, Alvin; Itzhaky, Shachar; Solar Lezama, Armando
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This paper demonstrates a novel combination of program synthesis and verification to lift stencil computations from low-level Fortran code to a high-level summary expressed using a predicate language. The technique is sound and mostly automated, and leverages counter-example guided inductive synthesis (CEGIS) to find provably correct translations. Lifting existing code to a high-performance description language has a number of benefits, including maintainability and performance portability. For example, our experiments show that the lifted summaries can enable domain specific compilers to do a better job of parallelization as compared to an off-the-shelf compiler working on the original code, and can even support fully automatic migration to hardware accelerators such as GPUs. We have implemented verified lifting in a system called STNG and have evaluated it using microbenchmarks, mini-apps, and real-world applications. We demonstrate the benefits of verified lifting by first automatically summarizing Fortran source code into a high-level predicate language, and subsequently translating the lifted summaries into Halide, with the translated code achieving median performance speedups of 4.1X and up to 24X for non-trivial stencils as compared to the original implementation.
Date issued
2016-06Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer ScienceJournal
Proceedings of the 37th ACM SIGPLAN Conference on Programming Language Design and Implementation - PLDI 2016
Publisher
Association for Computing Machinery (ACM)
Citation
Kamil, Shoaib, Alvin Cheung, Shachar Itzhaky, and Armando Solar-Lezama. “Verified Lifting of Stencil Computations.” Proceedings of the 37th ACM SIGPLAN Conference on Programming Language Design and Implementation - PLDI 2016 (2016).
Version: Author's final manuscript
ISBN
978-1-4503-4261-2