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dc.contributor.authorErbes, Andreja
dc.contributor.authorWang, Wentao
dc.contributor.authorWeinstein, Dana
dc.contributor.authorSeshia, Ashwin A.
dc.date.accessioned2018-09-07T19:28:14Z
dc.date.available2018-09-07T19:28:14Z
dc.date.issued2018-09
dc.identifier.issn0946-7076
dc.identifier.issn1432-1858
dc.identifier.urihttp://hdl.handle.net/1721.1/117683
dc.description.abstractThis papers investigates device approaches towards the confinement of acoustic modes in unreleased UHF MEMS resonators. Acoustic mode confinement is achieved using specially designed mechanically coupled acoustic cavities known as acoustic Bragg Grating Coupler structures to spatially localize the vibration energy within the resonators and thereby improve the motional impedance (R[subscript x]) and mechanical quality factor (Q). This enhancement in the mechanical response is demonstrated with numerical simulations using distinct unreleased resonator technologies involving dielectric transduction mechanisms. These initial investigations show improvements in the Q as well as enhanced vibrational amplitudes within the resonator domains (i.e. translating to improved R[subscript x] values) in the case of coupled cavities as opposed to single cavity designs. An initial approach to fabricate the devices in a CMOS compatible dual-trench technology are presented.en_US
dc.publisherSpringer Berlin Heidelbergen_US
dc.relation.isversionofhttps://doi.org/10.1007/s00542-018-4118-5en_US
dc.rightsCreative Commons Attributionen_US
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en_US
dc.sourceSpringer Berlin Heidelbergen_US
dc.titleAcoustic mode confinement using coupled cavity structures in UHF unreleased MEMS resonatorsen_US
dc.typeArticleen_US
dc.identifier.citationErbes, Andreja, et al. “Acoustic Mode Confinement Using Coupled Cavity Structures in UHF Unreleased MEMS Resonators.” Microsystem Technologies, Sept. 2018. © 2018 The Authorsen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.mitauthorWang, Wentao
dc.contributor.mitauthorWeinstein, Dana
dc.relation.journalMicrosystem Technologiesen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2018-09-07T03:47:45Z
dc.language.rfc3066en
dc.rights.holderThe Author(s)
dspace.orderedauthorsErbes, Andreja; Wang, Wentao; Weinstein, Dana; Seshia, Ashwin A.en_US
dspace.embargo.termsNen_US
mit.licensePUBLISHER_CCen_US


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