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dc.contributor.authorSaha, Sourabh Kumar
dc.contributor.authorCulpepper, Martin
dc.date.accessioned2018-11-09T15:08:24Z
dc.date.available2018-11-09T15:08:24Z
dc.date.issued2010-06
dc.date.submitted2010-04
dc.identifier.issn0003-6951
dc.identifier.issn1077-3118
dc.identifier.urihttp://hdl.handle.net/1721.1/118977
dc.description.abstractDip Pen Nanolithography is a direct write process that creates nanoscale dots and lines. Models typically predict dot and line size via assumption of constant ink flow rate from tip to substrate. This is appropriate for dot writing. It is however well-known, though models rarely reflect, that the ink flow rate depends upon writing speed during line writing. Herein, we explain the physical phenomenon that governs line writing and use this to model tip-substrate diffusion in line writing. We accurately predict (i) the increase in flow rate with writing speed and (ii) line width within 12.5%.en_US
dc.publisherAmerican Institute of Physics (AIP)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1063/1.3454777en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceOther repositoryen_US
dc.titleA surface diffusion model for Dip Pen Nanolithography line writingen_US
dc.typeArticleen_US
dc.identifier.citationSaha, Sourabh K. and Martin L. Culpepper. “A Surface Diffusion Model for Dip Pen Nanolithography Line Writing.” Applied Physics Letters 96, 24 (June 14, 2010): 243105 © 2010 American Institute of Physicsen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.mitauthorSaha, Sourabh Kumar
dc.contributor.mitauthorCulpepper, Martin
dc.relation.journalApplied Physics Lettersen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2018-11-09T14:41:41Z
dspace.orderedauthorsSaha, Sourabh K.; Culpepper, Martin L.en_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-8014-1940
mit.licensePUBLISHER_POLICYen_US


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