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dc.contributor.authorSaha, Sourabh Kumar
dc.contributor.authorCulpepper, Martin
dc.date.accessioned2018-11-15T20:40:47Z
dc.date.available2018-11-15T20:40:47Z
dc.date.issued2011-07
dc.date.submitted2011-06
dc.identifier.issn10871357
dc.identifier.urihttp://hdl.handle.net/1721.1/119131
dc.description.abstractDip pen nanolithography (DPN) is a flexible nanofabrication process for creating 2-D nanoscale features on a surface using an “inked” tip. Although a variety of ink-surface combinations can be used for creating 2-D nanofeatures using DPN, the process has not yet been characterized for high throughput and high quality manufacturing. Therefore, at present it is not possible to (i) predict whether fabricating a part is feasible within the constraints of the desired rate and quality and (ii) select/design equipment appropriate for the desired manufacturing goals. Herein, we have quantified the processing rate, tool life, and feature quality for DPN line writing by linking these manufacturing metrics to the process/system parameters. Based on this characterization, we found that (i) due to theoretical and practical constraints of current technology, the processing rate cannot be increased beyond about 20 times the typical rate of ∼1 μm2 /min, (ii) tool life for accurate line writing is limited to 1–5 min, and (iii) sensitivity of line width to process parameters decreases with an increase in the writing speed. Thus, we conclude that for a high throughput and high quality system, we need (i) parallelization or process modification to improve throughput and (ii) accurate fixtures for rapid tool change. We also conclude that process control at high speed writing is less stringent than at low speed writing, thereby suggesting that DPN has a niche in high speed writing of narrow lines.en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Grant No. 0914790)en_US
dc.publisherASME Internationalen_US
dc.relation.isversionofhttp://dx.doi.org/10.1115/1.4004406en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceASMEen_US
dc.titleCharacterization of the Dip Pen Nanolithography Process for Nanomanufacturingen_US
dc.typeArticleen_US
dc.identifier.citationSaha, Sourabh K., and Martin L. Culpepper. “Characterization of the Dip Pen Nanolithography Process for Nanomanufacturing.” Journal of Manufacturing Science and Engineering 133, no. 4 (2011): 041005. © 2011 by ASMEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.departmentMassachusetts Institute of Technology. Laboratory for Manufacturing and Productivityen_US
dc.contributor.mitauthorSaha, Sourabh Kumar
dc.contributor.mitauthorCulpepper, Martin
dc.relation.journalJournal of Manufacturing Science and Engineeringen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2018-11-09T14:25:12Z
dspace.orderedauthorsSaha, Sourabh K.; Culpepper, Martin L.en_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-8014-1940
mit.licensePUBLISHER_POLICYen_US


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