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dc.contributor.authorMoore, Elizabeth A.
dc.contributor.authorBadescu, Stefan C.
dc.contributor.authorWang, Evelyn N.
dc.contributor.authorBagnall, Kevin R.
dc.contributor.authorZhang, Lenan
dc.contributor.authorWang, Evelyn
dc.date.accessioned2019-01-14T16:43:59Z
dc.date.available2019-01-14T16:43:59Z
dc.date.issued2017-11
dc.date.submitted2017-05
dc.identifier.issn0034-6748
dc.identifier.issn1089-7623
dc.identifier.urihttp://hdl.handle.net/1721.1/120023
dc.description.abstractAs semiconductor devices based on silicon reach their intrinsic material limits, compound semiconductors, such as gallium nitride (GaN), are gaining increasing interest for high performance, solid-state transistor applications. Unfortunately, higher voltage, current, and/or power levels in GaN high electron mobility transistors (HEMTs) often result in elevated device temperatures, degraded performance, and shorter lifetimes. Although micro-Raman spectroscopy has become one of the most popular techniques for measuring localized temperature rise in GaN HEMTs for reliability assessment, decoupling the effects of temperature, mechanical stress, and electric field on the optical phonon frequencies measured by micro-Raman spectroscopy is challenging. In this work, we demonstrate the simultaneous measurement of temperature rise, inverse piezoelectric stress, thermoelastic stress, and vertical electric field via micro-Raman spectroscopy from the shifts of the E2(high), A1longitudinal optical (LO), and E2(low) optical phonon frequencies in wurtzite GaN. We also validate experimentally that the pinched OFF state as the unpowered reference accurately measures the temperature rise by removing the effect of the vertical electric field on the Raman spectrum and that the vertical electric field is approximately the same whether the channel is open or closed. Our experimental results are in good quantitative agreement with a 3D electro-thermo-mechanical model of the HEMT we tested and indicate that the GaN buffer acts as a semi-insulating, p-type material due to the presence of deep acceptors in the lower half of the bandgap. This implementation of micro-Raman spectroscopy offers an exciting opportunity to simultaneously probe thermal, mechanical, and electrical phenomena in semiconductor devices under bias, providing unique insight into the complex physics that describes device behavior and reliability. Although GaN HEMTs have been specifically used in this study to demonstrate its viability, this technique is applicable to any solid-state material with a suitable Raman response and will likely enable new measurement capabilities in a wide variety of scientific and engineering applications.en_US
dc.description.sponsorshipMassachusetts Institute of Technology. Microsystems Technology Laboratories. GaN Energy Initiativeen_US
dc.description.sponsorshipSingapore-MIT Alliance for Research and Technology Center. LEES Programen_US
dc.description.sponsorshipUnited States. Air Force. Air Force Research Laboratory. High-Reliability Electronics Virtual Centeren_US
dc.description.sponsorshipUnited States. Air Force. Office of Scientific Research (National Defense Science and Engineering Graduate (NDSEG) Fellowship, 32 CFR 168a)en_US
dc.publisherAIP Publishingen_US
dc.relation.isversionofhttp://dx.doi.org/10.1063/1.5010225en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceOther repositoryen_US
dc.titleSimultaneous measurement of temperature, stress, and electric field in GaN HEMTs with micro-Raman spectroscopyen_US
dc.typeArticleen_US
dc.identifier.citationBagnall, Kevin R., Elizabeth A. Moore, Stefan C. Badescu, Lenan Zhang, and Evelyn N. Wang. “Simultaneous Measurement of Temperature, Stress, and Electric Field in GaN HEMTs with Micro-Raman Spectroscopy.” Review of Scientific Instruments 88, no. 11 (November 2017): 113111.en_US
dc.contributor.departmentLincoln Laboratoryen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.mitauthorBagnall, Kevin R.
dc.contributor.mitauthorZhang, Lenan
dc.contributor.mitauthorWang, Evelyn
dc.relation.journalReview of Scientific Instrumentsen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2019-01-10T17:03:57Z
dspace.orderedauthorsBagnall, Kevin R.; Moore, Elizabeth A.; Badescu, Stefan C.; Zhang, Lenan; Wang, Evelyn N.en_US
dspace.embargo.termsNen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-5042-4819
dc.identifier.orcidhttps://orcid.org/0000-0001-7045-1200
mit.licensePUBLISHER_POLICYen_US


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