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dc.contributor.authorGuo, Yunfan
dc.contributor.authorSu, Cong
dc.contributor.authorShen, Pin-Chun
dc.contributor.authorLu, An
dc.contributor.authorHempel, Marek
dc.contributor.authorHan, Yimo
dc.contributor.authorJi, Qingqing
dc.contributor.authorLin, Yuxuan
dc.contributor.authorShi, Enzheng
dc.contributor.authorMcVay, Elaine D.
dc.contributor.authorDou, Letian
dc.contributor.authorMuller, David A.
dc.contributor.authorPalacios, Tomas
dc.contributor.authorLi, Ju
dc.contributor.authorLing, Xi
dc.contributor.authorKong, Jing
dc.date.accessioned2019-07-05T15:05:37Z
dc.date.available2019-07-05T15:05:37Z
dc.date.issued2019-02-12
dc.date.submitted2018-09
dc.identifier.issn0027-8424
dc.identifier.issn1091-6490
dc.identifier.urihttps://hdl.handle.net/1721.1/121495
dc.description.abstractThe 2D van der Waals crystals have shown great promise as potential future electronic materials due to their atomically thin and smooth nature, highly tailorable electronic structure, and mass production compatibility through chemical synthesis. Electronic devices, such as field effect transistors (FETs), from these materials require patterning and fabrication into desired structures. Specifically, the scale up and future development of “2D”-based electronics will inevitably require large numbers of fabrication steps in the patterning of 2D semiconductors, such as transition metal dichalcogenides (TMDs). This is currently carried out via multiple steps of lithography, etching, and transfer. As 2D devices become more complex (e.g., numerous 2D materials, more layers, specific shapes, etc.), the patterning steps can become economically costly and time consuming. Here, we developed a method to directly synthesize a 2D semiconductor, monolayer molybdenum disulfide (MoS₂), in arbitrary patterns on insulating SiO₂/Si via seed-promoted chemical vapor deposition (CVD) and substrate engineering. This method shows the potential of using the prepatterned substrates as a master template for the repeated growth of monolayer MoS₂ patterns. Our technique currently produces arbitrary monolayer MoS₂ patterns at a spatial resolution of 2 μm with excellent homogeneity and transistor performance (room temperature electron mobility of 30 cm²V⁻¹s⁻¹ and on–off current ratio of 10⁷. Extending this patterning method to other 2D materials can provide a facile method for the repeatable direct synthesis of 2D materials for future electronics and optoelectronics. Keywords: 2D semiconductor; monolayer MoS₂; patterned growth; growth mechanism; recyclable; masked growthen_US
dc.description.sponsorshipAir Force Office of Scientific Research (Grant FA9550-15-1-0514)en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Grant 0939514)en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Grant DMR-1231319)en_US
dc.language.isoen
dc.publisherNational Academy of Sciences (U.S.)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1073/pnas.1816197116en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourcePNASen_US
dc.titleAdditive manufacturing of patterned 2D semiconductor through recyclable masked growthen_US
dc.typeArticleen_US
dc.identifier.citationGuo, Yunfan et al. "Additive manufacturing of patterned 2D semiconductor through recyclable masked growth." Proceedings of the National Academy of Sciences 116, 9 (February 2019): 3437-3442 © 2019 National Academy of Sciencesen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Nuclear Science and Engineeringen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.departmentMassachusetts Institute of Technology. Research Laboratory of Electronicsen_US
dc.relation.journalProceedings of the National Academy of Sciencesen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2019-06-27T12:27:29Z
dspace.date.submission2019-06-27T12:27:34Z
mit.journal.volume116en_US
mit.journal.issue9en_US


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