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FolDTronics Demo: Creating 3D objects with integrated electronics using foldable honeycomb structures

Author(s)
Yamaoka, Junichi; Dogan, Mustafa Doga; Bulovic, Katarina M.; Kawahara, Yoshihiro; Kakehi, Yasuaki; Mueller, Stefanie; ... Show more Show less
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Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/
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Abstract
We present FoldTronics, a 2D-cutting based fabrication technique to integrate electronics into 3D folded objects. The key idea is to cut and perforate a 2D sheet to make it foldable into a honeycomb structure using a cutting plotter; before folding the sheet into a 3D structure, users place the electronic components and circuitry onto the sheet. The fabrication process only takes a few minutes enabling users to rapidly prototype functional interactive devices. The resulting objects are lightweight and rigid, thus allowing for weight-sensitive and force-sensitive applications. Finally, due to the nature of the honeycomb structure, the objects can be folded flat along one axis and thus can be efficiently transported in this compact form factor. We describe the structure of the foldable sheet, and present a design tool that enables users to quickly prototype the desired objects. We showcase a range of examples made with our design tool, including objects with integrated sensors and display elements.
Date issued
2019-05
URI
https://hdl.handle.net/1721.1/121522
Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science; Program in Media Arts and Sciences (Massachusetts Institute of Technology)
Journal
Proceedings of CHI ’19
Publisher
Association for Computing Machinery
Citation
Yamaoka, Junichi, Mustafa Doga Dogan, Katarina Bulovic, Kazuya Saito, Yoshihiro Kawahara, Yasuaki Kakehi and Stefanie Mueller. "FolDTronics Demo: Creating 3D objects with integrated electronics using foldable honeycomb structures." In Proceedings of CHI ’19, May 4–9, 2019, Glasgow, Scotland UK.
Version: Author's final manuscript
ISBN
78-1-4503-5970-2/19/05

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