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Materials and processing issues in vertical GaN power electronics

Author(s)
Hu, Jie; Zhang, Yuhao; Sun, Min; Piedra, Daniel; Chowdhury, Nadim; Palacios, Tomas; ... Show more Show less
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Creative Commons Attribution-NonCommercial-NoDerivs License http://creativecommons.org/licenses/by-nc-nd/4.0/
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Abstract
Silicon-based power devices are reaching their fundamental performance limit. The use of wide-bandgap semiconductors with superior material properties over silicon offers the potential for power electronic systems with much higher power densities and higher conversion efficiency. GaN, with a high critical electric field and carrier mobility, is considered one of the most promising candidates for future high-power, high frequency and high temperature applications. High voltage transistors and diodes based on both lateral and vertical structures are of great interest for future power electronics. Particularly, vertical GaN power devices have recently attracted increasing attention due to their many unique properties. This paper reviews recent progress and key remaining challenges towards the development of high-performance vertical GaN transistors and diodes with emphasis on the materials and processing issues related to each device architecture.
Date issued
2018-05
URI
https://hdl.handle.net/1721.1/121717
Department
Massachusetts Institute of Technology. Microsystems Technology Laboratories; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Journal
Materials Science in Semiconductor Processing
Publisher
Elsevier BV
Citation
Hu, Jie, Yuhao Zhang, Min Sun, Daniel Piedra, Nadim Chowdhury and Tomás Palacios. "Materials and processing issues in vertical GaN power electronics." Materials Science in Semiconductor Processing 78 (2017).
Version: Author's final manuscript
ISSN
1369-8001
Keywords
Mechanical Engineering, General Materials Science, Mechanics of Materials, Condensed Matter Physics

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