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dc.contributor.authorKim, Min-Cheol
dc.contributor.authorAbeyaratne, Rohan
dc.contributor.authorKamm, Roger Dale
dc.contributor.authorAsada, H. Harry
dc.date.accessioned2020-03-23T20:20:26Z
dc.date.available2020-03-23T20:20:26Z
dc.date.issued2017-07
dc.date.submitted2017-05
dc.identifier.isbn9781509059928
dc.identifier.urihttps://hdl.handle.net/1721.1/124201
dc.description.abstractWe have established a dynamic modeling framework for predicting spatiotemporal behaviors of cancer cell migration in the extracellular matrix (ECM). Dynamic model of cancer cell migration is integrated from four individual simulations, such as 1) filopodia penetration dynamics into the ECM, 2) intracellular mechanics including remodeling of cellular and nuclear membranes, contractile motion of actin stress fibers, and focal adhesion dynamics, 3) structural mechanics of ECM fiber networks, and 4) reaction diffusion mass transfer of degrading enzymes in the ECM. This work is motivated by experimental observations of malignant cancer cell migration, which shows that abundant filopodial formation in cancer cells is a critical characteristic of aggressive cancer cell which invade into the tissue. The dynamic model presented in this work suggests the mechanical interplay between filopodia of cancer cell and surrounding viscoelastic ECM fiber network. The work presented here compares filopodia dynamics in between soft and stiff ECMs varying its pore size.en_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionofhttp://dx.doi.org/10.23919/acc.2017.7963047en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceElizabeth Soergelen_US
dc.titleDynamic modeling of cancer cell migration in an extracellular matrix fiber networken_US
dc.typeArticleen_US
dc.identifier.citationKim, Min-Cheol et al. "Dynamic modeling of cancer cell migration in an extracellular matrix fiber network." Proceedings of the American Control Conference, May 2017, Seattle, Washington, USA, Institute of Electrical and Electronics Engineers, July 2017 © 2017 IEEEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.departmentSingapore-MIT Alliance in Research and Technology (SMART)en_US
dc.relation.journalProceedings of the American Control Conferenceen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.date.submission2019-06-18T17:53:56Z
mit.metadata.statusComplete


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