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dc.contributor.authorMaji, Saurav
dc.contributor.authorBanerjee, Utsav
dc.contributor.authorFuller, Samuel H.
dc.contributor.authorAbdelhamid, Mohamed R.
dc.contributor.authorNadeau, Phillip M.
dc.contributor.authorYazicigil, Rabia Tugce
dc.contributor.authorChandrakasan, Anantha P
dc.date.accessioned2020-04-28T19:10:13Z
dc.date.available2020-04-28T19:10:13Z
dc.date.issued2020-03
dc.identifier.isbn9781728160313
dc.identifier.urihttps://hdl.handle.net/1721.1/124910
dc.description.abstractAbstract: This paper presents a dual-factor authentication protocol and its low-power implementation for security of implantable medical devices (IMDs). The protocol incorporates traditional cryptographic first-factor authentication using Datagram Transport Layer Security - Pre-Shared Key (DTLS-PSK) followed by the user's touch-based voluntary second-factor authentication for enhanced security. With a low-power compact always-on wake-up timer and touch-based wake-up circuitry, our test chip consumes only 735 pW idle state power at 20.15 Hz and 2.5 V. The hardware accelerated dual-factor authentication unit consumes 8 µW at 660 kHz and 0.87 V. Our test chip was coupled with commercial Bluetooth Low Energy (BLE) transceiver, DC-DC converter, touch sensor and coin cell battery to demonstrate standalone implantable operation and also tested using in-vitro measurement setup. ©2020 Paper presented at the 2020 IEEE Custom Integrated Circuits Conference (CICC 2020), March 22-25, 2020, Boston, Mass.en_US
dc.description.sponsorshipAnalog Devices Inc.en_US
dc.publisherIEEEen_US
dc.relation.isversionof10.1109/cicc48029.2020.9075945en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceProf. Anantha P. Chandrakasanen_US
dc.titleA low-power dual-factor authentication unit for secure implantable devicesen_US
dc.typeArticleen_US
dc.identifier.citationMaji, Saurav, et al., "A low-power dual-factor authentication unit for secure implantable devices." IEEE Custom Integrated Circuits Conference (CICC) 2020 (Piscataway, N.J.: IEEE, 2020): p. 1-4 doi 10.1109/cicc48029.2020.9075945 ©2020 Author(s)en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.relation.journalIEEE Custom Integrated Circuits Conference (CICC)en_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.date.submission2020-04-28T00:47:47Z
mit.journal.volume2020en_US
mit.licenseOPEN_ACCESS_POLICY
mit.metadata.statusComplete


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