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dc.contributor.authorDu, H.
dc.contributor.authorFang, N. X.
dc.date.accessioned2020-06-02T13:02:15Z
dc.date.available2020-06-02T13:02:15Z
dc.date.issued2018-12
dc.identifier.issn2639-5274
dc.identifier.urihttps://hdl.handle.net/1721.1/125605
dc.description.abstractAdditive manufacturing based on liquid resin curing is one of the most promising methods to construct delicate structures. However, precision and speed are limited by the vertical adhesion of in situ cured resin at the curing interface. To overcome the unavoidable adhesion and to develop a general curing interface, we propose a slippery surface taking inspiration of the peristome surface of the pitcher plant. Such surface shows ultra-low adhesive energy at the curing interface due to the inhibition of the direct contact between the cured resin and the solid surface, which also increases the refilling speed of liquid resin. This ultra-low adhesive energy interface is effective for continuous 3D printing and provides insights into the physical mechanisms in reducing vertical solid-solid interfacial adhesion.en_US
dc.language.isoen
dc.publisherAmerican Association for the Advancement of Science (AAAS)en_US
dc.relation.isversionofhttps://dx.doi.org/10.1155/2018/4795604en_US
dc.rightsCreative Commons Attribution 4.0 International licenseen_US
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en_US
dc.sourceAAASen_US
dc.titleBioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesionen_US
dc.typeArticleen_US
dc.identifier.citationWu, L. et al. “Bioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion.” Research 2018 (2018): Article 4795604 © 2018 The Author(s)en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.relation.journalResearchen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2020-03-24T16:16:57Z
dspace.date.submission2020-03-24T16:17:00Z
mit.journal.volume2018en_US
mit.licensePUBLISHER_CC
mit.metadata.statusComplete


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