GelSlim: A High-Resolution, Compact, Robust, and Calibrated Tactile-sensing Finger
Author(s)
Donlon, Elliott; Dong, Siyuan; Liu, Melody; Li, Jianhua; Adelson, Edward H; Rodriguez Garcia, Alberto; ... Show more Show less
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This work describes the development of a high-resolution tactile-sensing finger for robot grasping. This finger, inspired by previous GelSight sensing techniques (Johnson and Adelson 2009), features an integration that is slimmer, more robust, and with more homogeneous output than previous vision-based tactile sensors. To achieve a compact integration, we redesign the optical path from illumination source to camera by combining light guides and an arrangement of mirror reflections. We parameterize the optical path with geometric design variables and describe the tradeoffs between the finger thickness, camera depth of field, and size of the tactile sensing area. The sensor sustains the wear from continuous use - and abuse - in grasping tasks by combining tougher materials for the compliant gel, a textured fabric skin, a structurally rigid body, and a calibration process that maintains homogeneous illumination and contrast of the tactile images during use. Finally, we evaluate the sensor's durability along four metrics that track the signal quality during more than 3000 grasping experiments. Keywords: Tactile sensors; Cameras; Three-dimensional displays; Grasping
Date issued
2019-01Department
Massachusetts Institute of Technology. Department of Mechanical Engineering; Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory; Massachusetts Institute of Technology. Department of Brain and Cognitive SciencesJournal
2018 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS)
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Donlon, Elliott et al. "GelSlim: A High-Resolution, Compact, Robust, and Calibrated Tactile-sensing Finger." 2018 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), October 2018, Madrid, Spain, Institute of Electrical and Electronics Engineers (IEEE), January 2019.
Version: Original manuscript
ISBN
9781538680940
978-1-5386-8093-3
ISSN
2153-0866