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dc.contributor.authorCzech, Bartlomiej
dc.contributor.authorde Boer, Jan
dc.contributor.authorGe, Dongsheng
dc.contributor.authorLamprou, Lampros
dc.date.accessioned2020-11-10T22:16:26Z
dc.date.available2020-11-10T22:16:26Z
dc.date.issued2019-11
dc.date.submitted2019-07
dc.identifier.issn1029-8479
dc.identifier.urihttps://hdl.handle.net/1721.1/128445
dc.description.abstractWe relate the Riemann curvature of a holographic spacetime to an entangle- ment property of the dual CFT state: the Berry curvature of its modular Hamiltonians. The modular Berry connection encodes the relative bases of nearby CFT subregions while its bulk dual, restricted to the code subspace, relates the edge-mode frames of the cor- responding entanglement wedges. At leading order in 1/N and for sufficiently smooth HRRT surfaces, the modular Berry connection simply sews together the orthonormal co- ordinate systems covering neighborhoods of HRRT surfaces. This geometric perspective on entanglement is a promising new tool for connecting the dynamics of entanglement and gravitation.en_US
dc.publisherSpringer Science and Business Media LLCen_US
dc.relation.isversionofhttp://dx.doi.org/10.1007/jhep11(2019)094en_US
dc.rightsCreative Commons Attributionen_US
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en_US
dc.sourceSpringer Berlin Heidelbergen_US
dc.titleA modular sewing kit for entanglement wedgesen_US
dc.typeArticleen_US
dc.identifier.citationCzech, Bartlomiej et al. "A modular sewing kit for entanglement wedges." Journal of High Energy Physics 2019, 11 (November 2019): 94en_US
dc.contributor.departmentMassachusetts Institute of Technology. Center for Theoretical Physicsen_US
dc.relation.journalJournal of High Energy Physicsen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2020-06-26T13:07:46Z
dc.language.rfc3066en
dc.rights.holderThe Author(s)
dspace.embargo.termsN
dspace.date.submission2020-06-26T13:07:46Z
mit.journal.volume2019en_US
mit.journal.issue11en_US
mit.licensePUBLISHER_CC
mit.metadata.statusComplete


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