dc.contributor.author | Yang, Yang | |
dc.contributor.author | Burghoff, David Patrick | |
dc.contributor.author | Hu, Qing | |
dc.date.accessioned | 2021-01-25T20:03:45Z | |
dc.date.available | 2021-01-25T20:03:45Z | |
dc.date.issued | 2019-05 | |
dc.date.submitted | 2019-05 | |
dc.identifier.issn | 2334-2536 | |
dc.identifier.uri | https://hdl.handle.net/1721.1/129555 | |
dc.description.abstract | Hyperspectral imaging is a spectroscopic imaging technique that allows for the creation of images with pixels containing information from multiple spectral bands. At terahertz wavelengths, it has emerged as a prominent tool for a number of applications, ranging from nonionizing cancer diagnosis and pharmaceutical characterization to nondestructive artifact testing. Contemporary terahertz imaging systems typically rely on nonlinear optical downconversion of a fiber-based near-infrared femtosecond laser, requiring complex optical systems. Here, we demonstrate hyperspectral imaging with chip-scale frequency combs based on terahertz quantum cascade lasers. The dual combs are freerunning and emit coherent terahertz radiation that covers a bandwidth of 220 GHz at 3.4 THz with ~10 µW per line. The combination of the fast acquisition rate of dual-comb spectroscopy with the monolithic design, scalability, and chip-scale size of the combs is highly appealing for future imaging applications in biomedicine and the pharmaceutical industry. | en_US |
dc.description.sponsorship | United States. Defense Advanced Research Projects Agency (Grant (W31P4Q-16-1-0001) | en_US |
dc.description.sponsorship | United States. National Aeronautics and Space Administration (Grant DE-NA-0003525) | en_US |
dc.language.iso | en | |
dc.publisher | Optical Society of America (OSA) | en_US |
dc.relation.isversionof | 10.1364/OPTICA.6.000766 | en_US |
dc.rights | Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. | en_US |
dc.source | OSA Publishing | en_US |
dc.title | Terahertz hyperspectral imaging with dual chip-scale combs | en_US |
dc.type | Article | en_US |
dc.identifier.citation | Sterczewski, Lukasz A. et al. “Terahertz hyperspectral imaging with dual chip-scale combs.” Optica 6, 6 (May 2019): 766-771 © 2019 The Author(s) | en_US |
dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | en_US |
dc.contributor.department | Massachusetts Institute of Technology. Research Laboratory of Electronics | en_US |
dc.relation.journal | Optica | en_US |
dc.eprint.version | Final published version | en_US |
dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
dc.date.updated | 2020-12-18T13:51:52Z | |
dspace.orderedauthors | Sterczewski, LA; Westberg, J; Yang, Y; Burghoff, D; Reno, J; Hu, Q; Wysocki, G | en_US |
dspace.date.submission | 2020-12-18T13:51:57Z | |
mit.journal.volume | 6 | en_US |
mit.journal.issue | 6 | en_US |
mit.license | PUBLISHER_POLICY | |
mit.metadata.status | Complete | |