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dc.contributor.authorZhang, Zhengxing
dc.contributor.authorEl-Henawy, Sally I.
dc.contributor.authorSadun, Allan
dc.contributor.authorMiller, Ryan
dc.contributor.authorDaniel, Luca
dc.contributor.authorWhite, Jacob K.
dc.contributor.authorBoning, Duane S
dc.date.accessioned2021-06-10T20:28:00Z
dc.date.available2021-06-10T20:28:00Z
dc.date.issued2019-10
dc.date.submitted2019-05
dc.identifier.isbn9781538695166
dc.identifier.urihttps://hdl.handle.net/1721.1/130927
dc.description.abstractWith the rising demand for integrated silicon photonics as a technology platform, it becomes crucial to provide variation-aware models and design for manufacturability (DFM) methods to inform the design of silicon photonic devices and circuits. In this paper, we demonstrate the application of the adjoint method to estimating the sensitivity of photonic components against key process variations inherited from integrated circuit fabrication technologies. In particular, we examine the impact of line edge roughness (LER) on a passive Y-branch, and validate our results with ensemble virtual fabrication simulations. The adjoint sensitivity and variance estimation of Y-branch transmission imbalance is seen to be highly efficient in comparison to direct ensemble simulation.en_US
dc.language.isoen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/nemo.2019.8853679en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourceLuca Danielen_US
dc.titleAdjoint-Based Sensitivity Analysis for Silicon Photonic Variationsen_US
dc.typeArticleen_US
dc.identifier.citationZhengxing, Zhang et al. "Adjoint-Based Sensitivity Analysis for Silicon Photonic Variations." 2019 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, May 2019, Boston, MA, Institute of Electrical and Electronics Engineers, October 2019. © 2019 IEEEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.relation.journal2019 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimizationen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2021-06-09T16:50:44Z
dspace.orderedauthorsZhang, Z; El-Henawy, SI; Sadun, A; Miller, R; Daniel, L; White, JK; Boning, DSen_US
dspace.date.submission2021-06-09T16:50:45Z
mit.licenseOPEN_ACCESS_POLICY
mit.metadata.statusComplete


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