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dc.contributor.authorFathipour, Sara
dc.contributor.authorAlmeida, Sergio Fabian
dc.contributor.authorYe, Zhixin Alice
dc.contributor.authorSaha, Bivas
dc.contributor.authorNiroui, Farnaz
dc.contributor.authorKing Liu, Tsu-Jae
dc.contributor.authorWu, Junqiao
dc.date.accessioned2021-10-27T20:09:18Z
dc.date.available2021-10-27T20:09:18Z
dc.date.issued2019
dc.identifier.urihttps://hdl.handle.net/1721.1/134812
dc.description.abstract© 2019 Author(s). To enable energy-efficient electronic devices for the future, nano-electro-mechanical (NEM) relays are promising due to their high ON/OFF current ratio and potential for low operating voltage. To minimize hysteresis and, consequently, relay operating voltage, it is imperative to reduce the relay contact adhesion, which can be achieved by coating the contacts with anti-stiction self-assembled monolayers. Herein we report a 71% reduction in hysteresis voltage by utilizing a branched perfluorocarbon antistiction molecule: Perfluoro (2,3-Dimethylbutan-2-ol) (PDB) on top of the tungsten contact surfaces. Experimental results show the operation of a PDB-coated NEM relay with abrupt switching, undetectably low OFF-state current, hysteresis voltage as low as 20 mV, and a large ON/OFF current ratio (>107).
dc.language.isoen
dc.publisherAIP Publishing
dc.relation.isversionof10.1063/1.5095760
dc.rightsCreative Commons Attribution 4.0 International license
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.sourceAmerican Institute of Physics (AIP)
dc.titleReducing adhesion energy of nano-electro-mechanical relay contacts by self-assembled Perfluoro (2,3-Dimethylbutan-2-ol) coating
dc.typeArticle
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.relation.journalAIP Advances
dc.eprint.versionFinal published version
dc.type.urihttp://purl.org/eprint/type/JournalArticle
eprint.statushttp://purl.org/eprint/status/PeerReviewed
dc.date.updated2021-02-03T16:25:25Z
dspace.orderedauthorsFathipour, S; Almeida, SF; Ye, ZA; Saha, B; Niroui, F; King Liu, T-J; Wu, J
dspace.date.submission2021-02-03T16:25:29Z
mit.journal.volume9
mit.journal.issue5
mit.licensePUBLISHER_CC
mit.metadata.statusAuthority Work and Publication Information Needed


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