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dc.contributor.authorSundaram, Subramanian
dc.contributor.authorKim, David S
dc.contributor.authorBaldo, Marc A
dc.contributor.authorHayward, Ryan C
dc.contributor.authorMatusik, Wojciech
dc.date.accessioned2021-10-27T20:09:28Z
dc.date.available2021-10-27T20:09:28Z
dc.date.issued2017
dc.identifier.urihttps://hdl.handle.net/1721.1/134848
dc.description.abstract© 2017 American Chemical Society. Self-transforming structures are gaining prominence due to their general ability to adopt programmed shapes each tailored for specific functions. Composites that self-fold have so far relied on using the stimuli-responsive mechanisms focusing on reversible shape change. Integrating additional functions within these composites can rapidly enhance their practical applicability; however, this remains a challenging problem. Here, we demonstrate a method for spontaneous folding of three-dimensional (3D)-printed composites with embedded electronics at room temperature. The composite is printed using a multimaterial 3D-printing process with no external processing steps. Upon peeling from the print platform, the composite self-shapes itself using the residual forces resulting from polymer swelling during the layer-by-layer fabrication process. As a specific example, electrochromic elements are printed within the composite and can be electrically controlled through its folded legs. Our shape-transformation scheme provides a route to transform planar electronics into nonplanar geometries containing the overhangs. Integrating electronics within complex 3D shapes can enable new applications in sensing and robotics.
dc.language.isoen
dc.publisherAmerican Chemical Society (ACS)
dc.relation.isversionof10.1021/ACSAMI.7B10443
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
dc.sourceACS
dc.title3D-Printed Self-Folding Electronics
dc.typeArticle
dc.relation.journalACS Applied Materials & Interfaces
dc.eprint.versionFinal published version
dc.type.urihttp://purl.org/eprint/type/JournalArticle
eprint.statushttp://purl.org/eprint/status/PeerReviewed
dc.date.updated2019-05-03T17:34:30Z
dspace.orderedauthorsSundaram, S; Kim, DS; Baldo, MA; Hayward, RC; Matusik, W
dspace.date.submission2019-05-03T17:34:33Z
mit.journal.volume9
mit.journal.issue37
mit.metadata.statusAuthority Work and Publication Information Needed


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