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Hybrid Integration of III–V Solar Microcells for High-Efficiency Concentrated Photovoltaic Modules

dc.contributor.authorTauke-Pedretti, Anna
dc.contributor.authorCederberg, Jeffrey G
dc.contributor.authorCruz-Campa, Jose L
dc.contributor.authorAlford, Charles
dc.contributor.authorSanchez, Carlos A
dc.contributor.authorNielson, Gregory N
dc.contributor.authorOkandan, Murat
dc.contributor.authorSweatt, William
dc.contributor.authorJared, Bradley H
dc.contributor.authorSaavedra, Michael
dc.contributor.authorMiller, William
dc.contributor.authorKeeler, Gordon A
dc.contributor.authorPaap, Scott
dc.contributor.authorMudrick, John
dc.contributor.authorLentine, Anthony
dc.contributor.authorResnick, Paul
dc.contributor.authorGupta, Vipin
dc.contributor.authorNelson, Jeffrey
dc.contributor.authorLi, Lan
dc.contributor.authorLi, Duanhui
dc.contributor.authorGu, Tian
dc.contributor.authorHu, Juejun
dc.date.accessioned2021-10-27T20:29:18Z
dc.date.available2021-10-27T20:29:18Z
dc.date.issued2018
dc.identifier.urihttps://hdl.handle.net/1721.1/135789
dc.description.abstract© 1995-2012 IEEE. The design, fabrication, and performance of InGaAs and InGaP/GaAs microcells are presented. These cells are integrated with a Si wafer providing a path for insertion in hybrid concentrated photovoltaic modules. Comparisons are made between bonded cells and cells fabricated on their native wafer. The bonded cells showed no evidence of degradation in spite of the integration process that involved significant processing including the removal of the III-V substrate.
dc.language.isoen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.isversionof10.1109/JSTQE.2018.2812218
dc.rightsCreative Commons Attribution-Noncommercial-Share Alike
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/
dc.sourceOther repository
dc.titleHybrid Integration of III–V Solar Microcells for High-Efficiency Concentrated Photovoltaic Modules
dc.typeArticle
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.contributor.departmentLincoln Laboratory
dc.relation.journalIEEE Journal on Selected Topics in Quantum Electronics
dc.eprint.versionAuthor's final manuscript
dc.type.urihttp://purl.org/eprint/type/JournalArticle
eprint.statushttp://purl.org/eprint/status/PeerReviewed
dc.date.updated2019-09-20T16:50:30Z
dspace.orderedauthorsTauke-Pedretti, A; Cederberg, JG; Cruz-Campa, JL; Alford, C; Sanchez, CA; Nielson, GN; Okandan, M; Sweatt, W; Jared, BH; Saavedra, M; Miller, W; Keeler, GA; Paap, S; Mudrick, J; Lentine, A; Resnick, P; Gupta, V; Nelson, J; Li, L; Li, D; Gu, T; Hu, J
dspace.date.submission2019-09-20T16:50:33Z
mit.journal.volume24
mit.journal.issue2
mit.metadata.statusAuthority Work and Publication Information Needed


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