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3D integrated superconducting qubits

Author(s)
Rosenberg, D; Kim, D; Das, R; Yost, D; Gustavsson, S; Hover, D; Krantz, P; Melville, A; Racz, L; Samach, GO; Weber, SJ; Yan, F; Yoder, JL; Kerman, AJ; Oliver, WD; ... Show more Show less
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Abstract
As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence ($T_1$, $T_{2,\rm{echo}} > 20\,\mu$s) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.
Date issued
2017
URI
https://hdl.handle.net/1721.1/136342
Department
Lincoln Laboratory; Massachusetts Institute of Technology. Research Laboratory of Electronics; Massachusetts Institute of Technology. Department of Physics
Journal
npj Quantum Information
Publisher
Springer Nature America, Inc

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