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dc.contributor.authorGanobjak, Michal
dc.contributor.authorCarstensen, Josephine V.
dc.date.accessioned2021-11-02T14:29:12Z
dc.date.available2021-11-02T14:29:12Z
dc.date.issued2019-11
dc.identifier.issn1742-6588
dc.identifier.issn1742-6596
dc.identifier.urihttps://hdl.handle.net/1721.1/137094
dc.description.abstract© Published under licence by IOP Publishing Ltd. This research presents the design of a new clay brick filled with aerogel. The design has been performed using multi-objective topology optimization that considers both stiffness and thermal conductivity. The current research uses the free-form design method of topology optimization with set boundary conditions for the evaluation of the stiffness and thermal conductivity. The internal structure of a standard-sized brick filled with aerogel is designed in this work. The article also offers numerical evaluations that compare the performance of the new optimized design to a standard full brick. A topology optimized-brick design is presented and shown to significantly improve the thermal insulation. Suggestions for future research include performing experimentally validations.en_US
dc.language.isoen
dc.publisherIOP Publishingen_US
dc.relation.isversionof10.1088/1742-6596/1343/1/012195en_US
dc.rightsCreative Commons Attribution 3.0 unported licenseen_US
dc.rights.urihttps://creativecommons.org/licenses/by/3.0/en_US
dc.sourceIOP Publishingen_US
dc.titleTopology-optimized insulating facebrick with aerogel fillingen_US
dc.typeArticleen_US
dc.identifier.citationGanobjak, Michal and Carstensen, Josephine V. 2019. "Topology-optimized insulating facebrick with aerogel filling." Journal of Physics: Conference Series, 1343 (1).
dc.relation.journalJournal of Physics: Conference Seriesen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.date.updated2020-06-04T15:38:45Z
dspace.date.submission2020-06-04T15:38:48Z
mit.journal.volume1343en_US
mit.journal.issue1en_US
mit.licensePUBLISHER_CC
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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