| dc.contributor.author | Lienhard, Benjamin | |
| dc.contributor.author | Gustavsson, Simon | |
| dc.contributor.author | Braumuller, Jochen | |
| dc.contributor.author | Woods, Wayne | |
| dc.contributor.author | Rosenberg, Danna | |
| dc.contributor.author | Calusine, Greg | |
| dc.contributor.author | Weber, Steven J. | |
| dc.contributor.author | Vepsalainen, Antti | |
| dc.contributor.author | O'Brien, Kevin | |
| dc.contributor.author | Orlando, Terry Philip | |
| dc.contributor.author | Oliver, William D | |
| dc.date.accessioned | 2022-01-03T19:42:48Z | |
| dc.date.available | 2021-11-04T17:03:12Z | |
| dc.date.available | 2022-01-03T19:42:48Z | |
| dc.date.issued | 2019-06 | |
| dc.identifier.uri | https://hdl.handle.net/1721.1/137375.2 | |
| dc.description.abstract | © 2019 IEEE. Over the past two decades, the performance of superconducting quantum circuits has tremendously improved. The progress of superconducting qubits enabled a new industry branch to emerge from global technology enterprises to quantum computing startups. Here, an overview of superconducting quantum circuit microwave control is presented. Furthermore, we discuss one of the persistent engineering challenges in the field - how to control the electromagnetic environment of increasingly complex superconducting circuits such that they are simultaneously protected and efficiently controllable. | en_US |
| dc.description.sponsorship | Air Force (Contract FA8721-05-C-0002) | en_US |
| dc.language.iso | en | |
| dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en_US |
| dc.relation.isversionof | 10.1109/MWSYM.2019.8701119 | en_US |
| dc.rights | Creative Commons Attribution-Noncommercial-Share Alike | en_US |
| dc.rights.uri | http://creativecommons.org/licenses/by-nc-sa/4.0/ | en_US |
| dc.source | arXiv | en_US |
| dc.title | Microwave Packaging for Superconducting Qubits | en_US |
| dc.type | Article | en_US |
| dc.identifier.citation | Lienhard, Benjamin, Gustavsson, Simon, Oliver, William D, Braumuller, Jochen, Woods, Wayne et al. 2019. "Microwave Packaging for Superconducting Qubits." IEEE MTT-S International Microwave Symposium Digest, 2019-June. | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Research Laboratory of Electronics | en_US |
| dc.contributor.department | Lincoln Laboratory | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Physics | en_US |
| dc.relation.journal | IEEE MTT-S International Microwave Symposium Digest | en_US |
| dc.eprint.version | Author's final manuscript | en_US |
| dc.type.uri | http://purl.org/eprint/type/ConferenceItem | en_US |
| eprint.status | http://purl.org/eprint/status/NonPeerReviewed | en_US |
| dc.date.updated | 2021-02-03T15:52:23Z | |
| dspace.orderedauthors | Lienhard, B; Gustavsson, S; Oliver, WD; Braumuller, J; Woods, W; Rosenberg, D; Calusine, G; Weber, S; Vepsalainen, A; O'Brien, K; Orlando, TP | en_US |
| dspace.date.submission | 2021-02-03T15:52:31Z | |
| mit.journal.volume | 2019-June | en_US |
| mit.license | OPEN_ACCESS_POLICY | |
| mit.metadata.status | Publication Information Needed | en_US |
