| dc.contributor.author | Mao, Jun |  | 
| dc.contributor.author | Chen, Gang |  | 
| dc.contributor.author | Ren, Zhifeng |  | 
| dc.date.accessioned | 2021-12-16T18:30:02Z |  | 
| dc.date.available | 2021-12-16T16:32:12Z |  | 
| dc.date.available | 2021-12-16T18:30:02Z |  | 
| dc.date.issued | 2021 |  | 
| dc.identifier.uri | https://hdl.handle.net/1721.1/138505.2 |  | 
| dc.description.abstract | © 2020, Springer Nature Limited. Solid-state thermoelectric devices can directly convert electricity into cooling or enable heat pumping through the Peltier effect. The commercialization of thermoelectric cooling technology has been built on the Bi2Te3 alloys, which have had no rival for the past six decades around room temperature. With the discovery and development of more promising materials, it is possible to reshape thermoelectric cooling technology. Here we review the current status of, and future outlook for, thermoelectric cooling materials. | en_US | 
| dc.language.iso | en |  | 
| dc.publisher | Springer Science and Business Media LLC | en_US | 
| dc.relation.isversionof | 10.1038/S41563-020-00852-W | en_US | 
| dc.rights | Creative Commons Attribution-Noncommercial-Share Alike | en_US | 
| dc.rights.uri | http://creativecommons.org/licenses/by-nc-sa/4.0/ | en_US | 
| dc.source | Other repository | en_US | 
| dc.title | Thermoelectric cooling materials | en_US | 
| dc.type | Article | en_US | 
| dc.identifier.citation | Mao, Jun, Chen, Gang and Ren, Zhifeng. 2021. "Thermoelectric cooling materials." Nature Materials, 20 (4). | en_US | 
| dc.contributor.department | Massachusetts Institute of Technology. Department of Mechanical Engineering | en_US | 
| dc.relation.journal | Nature Materials | en_US | 
| dc.eprint.version | Author's final manuscript | en_US | 
| dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US | 
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US | 
| dc.date.updated | 2021-12-16T16:29:36Z |  | 
| dspace.orderedauthors | Mao, J; Chen, G; Ren, Z | en_US | 
| dspace.date.submission | 2021-12-16T16:29:38Z |  | 
| mit.journal.volume | 20 | en_US | 
| mit.journal.issue | 4 | en_US | 
| mit.license | OPEN_ACCESS_POLICY |  | 
| mit.metadata.status | Publication Information Needed | en_US |