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dc.contributor.authorAnderegg, Loïc
dc.contributor.authorBurchesky, Sean
dc.contributor.authorBao, Yicheng
dc.contributor.authorYu, Scarlett S
dc.contributor.authorKarman, Tijs
dc.contributor.authorChae, Eunmi
dc.contributor.authorNi, Kang-Kuen
dc.contributor.authorKetterle, Wolfgang
dc.contributor.authorDoyle, John M
dc.date.accessioned2022-04-20T18:40:57Z
dc.date.available2022-04-20T18:40:57Z
dc.date.issued2021
dc.identifier.urihttps://hdl.handle.net/1721.1/141994
dc.description.abstract<jats:title>Shielding ultracold molecules</jats:title> <jats:p> Ultracold molecules hold promise for a wide range of exciting applications. However, such applications are currently hampered by the limited number of ultracold molecular ensembles that can be created and by their short lifetimes. Anderegg <jats:italic>et al</jats:italic> . used a microwave dressing field to tune the collisional properties of calcium monofluoride molecules trapped in optical tweezers. This approach allowed a sixfold suppression of inelastic trap-loss collisions. This scheme paves the way for the creation of a variety of long-lived ultracold molecular ensembles. —YS </jats:p>en_US
dc.language.isoen
dc.publisherAmerican Association for the Advancement of Science (AAAS)en_US
dc.relation.isversionof10.1126/SCIENCE.ABG9502en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourcearXiven_US
dc.titleObservation of microwave shielding of ultracold moleculesen_US
dc.typeArticleen_US
dc.identifier.citationAnderegg, Loïc, Burchesky, Sean, Bao, Yicheng, Yu, Scarlett S, Karman, Tijs et al. 2021. "Observation of microwave shielding of ultracold molecules." Science, 373 (6556).
dc.relation.journalScienceen_US
dc.eprint.versionOriginal manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2022-04-20T18:35:40Z
dspace.orderedauthorsAnderegg, L; Burchesky, S; Bao, Y; Yu, SS; Karman, T; Chae, E; Ni, K-K; Ketterle, W; Doyle, JMen_US
dspace.date.submission2022-04-20T18:35:42Z
mit.journal.volume373en_US
mit.journal.issue6556en_US
mit.licenseOPEN_ACCESS_POLICY
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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