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dc.contributor.authorSaLoutos, Andrew
dc.contributor.authorStanger-Jones, Elijah
dc.contributor.authorGuo, Menglong
dc.contributor.authorKim, Hongmin
dc.contributor.authorKim, Sangbae
dc.date.accessioned2024-02-28T17:11:01Z
dc.date.available2024-02-28T17:11:01Z
dc.date.issued2023-05-29
dc.identifier.urihttps://hdl.handle.net/1721.1/153601
dc.description.abstractWe introduce a spherical fingertip sensor for dynamic manipulation. It is based on barometric pressure and time-of-flight proximity sensors and is low-latency, compact, and physically robust. The sensor uses a trained neural network to estimate the contact location and three-axis contact forces based on data from the pressure sensors, which are embedded within the sensor’s sphere of polyurethane rubber. The timeof-flight sensors face in three different outward directions, and an integrated microcontroller samples each of the individual sensors at up to 200 Hz. To quantify the effect of system latency on dynamic manipulation performance, we develop and analyze a metric called the collision impulse ratio and characterize the end-to-end latency of our new sensor. We also present experimental demonstrations with the sensor, including measuring contact transitions, performing coarse mapping, maintaining a contact force with a moving object, and reacting to avoid collisions.en_US
dc.language.isoen
dc.publisherIEEEen_US
dc.relation.isversionof10.1109/icra48891.2023.10160256en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/en_US
dc.sourcearxiven_US
dc.titleDesign of a Multimodal Fingertip Sensor for Dynamic Manipulationen_US
dc.typeArticleen_US
dc.identifier.citationSaLoutos, Andrew, Stanger-Jones, Elijah, Guo, Menglong, Kim, Hongmin and Kim, Sangbae. 2023. "Design of a Multimodal Fingertip Sensor for Dynamic Manipulation." 2023 IEEE International Conference on Robotics and Automation (ICRA).
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.relation.journal2023 IEEE International Conference on Robotics and Automation (ICRA)en_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2024-02-28T17:00:58Z
dspace.orderedauthorsSaLoutos, A; Stanger-Jones, E; Guo, M; Kim, H; Kim, Sen_US
dspace.date.submission2024-02-28T17:01:00Z
mit.licenseOPEN_ACCESS_POLICY
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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