| dc.contributor.author | Bender, Emmanuel | |
| dc.contributor.author | Bernstein, Joseph B. | |
| dc.contributor.author | Boning, Duane S. | |
| dc.date.accessioned | 2024-03-27T16:03:04Z | |
| dc.date.available | 2024-03-27T16:03:04Z | |
| dc.date.issued | 2024-03-15 | |
| dc.identifier.issn | 2072-666X | |
| dc.identifier.uri | https://hdl.handle.net/1721.1/153951 | |
| dc.description.abstract | In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes. | en_US |
| dc.publisher | MDPI AG | en_US |
| dc.relation.isversionof | 10.3390/mi15030398 | en_US |
| dc.rights | Creative Commons Attribution | en_US |
| dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | en_US |
| dc.source | Multidisciplinary Digital Publishing Institute | en_US |
| dc.subject | Electrical and Electronic Engineering | en_US |
| dc.subject | Mechanical Engineering | en_US |
| dc.subject | Control and Systems Engineering | en_US |
| dc.title | Modern Trends in Microelectronics Packaging Reliability Testing | en_US |
| dc.type | Article | en_US |
| dc.identifier.citation | Micromachines 15 (3): 398 (2024) | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Microsystems Technology Laboratories | |
| dc.relation.journal | Micromachines | en_US |
| dc.identifier.mitlicense | PUBLISHER_CC | |
| dc.eprint.version | Final published version | en_US |
| dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
| dc.date.updated | 2024-03-27T13:15:46Z | |
| dspace.date.submission | 2024-03-27T13:15:46Z | |
| mit.journal.volume | 15 | en_US |
| mit.journal.issue | 3 | en_US |
| mit.license | PUBLISHER_CC | |
| mit.metadata.status | Authority Work and Publication Information Needed | en_US |
