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SustainaPrint: Making the Most of Eco-Friendly Filaments

Author(s)
Perroni-Scharf, Maxine; Xiao, Jennifer; Paulin, Cole; Wang, Zhi Ray; Sethapakdi, Ticha; Abdullah, Muhammad; Baudisch, Patrick; Mueller, Stefanie; ... Show more Show less
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Creative Commons Attribution-Noncommercial-ShareAlike http://creativecommons.org/licenses/by-nc-sa/4.0/
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Abstract
We present SustainaPrint, a system for integrating eco-friendly filaments into 3D printing without compromising structural integrity. While biodegradable and recycled 3D printing filaments offer environmental benefits, there is a trade-off in using them as they may suffer from degraded or unpredictable mechanical properties, which can limit their use in load-bearing applications. SustainaPrint addresses this by strategically assigning eco-friendly and standard filaments to different regions of a multi-material print—reinforcing the areas that are most likely to break with stronger material while maximizing the use of sustainable filament elsewhere. As eco-friendly filaments often do not come with technical datasheets, we also introduce a low-cost, at-home mechanical testing toolkit that enables users to evaluate filament strength before deciding if they want to use that filament in our pipeline. We validate SustainaPrint through real-world fabrication and mechanical testing, demonstrating its effectiveness across a range of functional 3D printing tasks.
Description
UIST ’25, Busan, Republic of Korea
Date issued
2025-09-27
URI
https://hdl.handle.net/1721.1/163063
Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory
Publisher
ACM|The 38th Annual ACM Symposium on User Interface Software and Technology
Citation
Maxine Perroni-Scharf, Jennifer Xiao, Cole Paulin, Zhi Ray Wang, Ticha Sethapakdi, Muhammad Abdullah, Patrick Baudisch, and Stefanie Mueller. 2025. SustainaPrint: Making the Most of Eco-Friendly Filaments. In Proceedings of the 38th Annual ACM Symposium on User Interface Software and Technology (UIST '25). Association for Computing Machinery, New York, NY, USA, Article 104, 1–13.
Version: Final published version
ISBN
979-8-4007-2037-6

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