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dc.contributor.authorGomez, Leonardo
dc.contributor.authorHashemi, Pouya
dc.contributor.authorHoyt, Judy L.
dc.date.accessioned2010-03-08T17:47:36Z
dc.date.available2010-03-08T17:47:36Z
dc.date.issued2009-10
dc.date.submitted2009-05
dc.identifier.issn0018-9383
dc.identifier.otherINSPEC Accession Number: 10929303
dc.identifier.urihttp://hdl.handle.net/1721.1/52379
dc.description.abstractHole mobility and velocity are extracted from scaled strained-Si[subscript 0.4]5Ge[subscript 0.55]channel p-MOSFETs on insulator. Devices have been fabricated with sub-100-nm gate lengths, demonstrating hole mobility and velocity enhancements in strained- Si[subscript 0.4]5Ge[subscript 0.55]channel devices relative to Si. The effective hole mobility is extracted utilizing the dR/dL method. A hole mobility enhancement is observed relative to Si hole universal mobility for short-channel devices with gate lengths ranging from 65 to 150 nm. Hole velocities extracted using several different methods are compared. The hole velocity of strained-SiGe p-MOSFETs is enhanced over comparable Si control devices. The hole velocity enhancements extracted are on the order of 30%. Ballistic velocity simulations suggest that the addition of (110) uniaxial compressive strain to Si[subscript 0.4]5Ge[subscript 0.55] can result in a more substantial increase in velocity relative to relaxed Si.en
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen
dc.relation.isversionofhttp://dx.doi.org/10.1109/ted.2009.2031043en
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en
dc.sourceIEEEen
dc.subjectuniaxial stressen
dc.subjectsilicon germaniumen
dc.subjectp-MOSFETen
dc.subjecthole velocityen
dc.subjecthole mobilityen
dc.titleEnhanced Hole Transport in Short-Channel Strained-SiGe p-MOSFETsen
dc.typeArticleen
dc.identifier.citationGomez, L., P. Hashemi, and J.L. Hoyt. “Enhanced Hole Transport in Short-Channel Strained-SiGe p-MOSFETs.” Electron Devices, IEEE Transactions on 56.11 (2009): 2644-2651. © 2009 Institute of Electrical and Electronics Engineersen
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverHoyt, Judy L.
dc.contributor.mitauthorGomez, Leonardo
dc.contributor.mitauthorHashemi, Pouya
dc.contributor.mitauthorHoyt, Judy L.
dc.relation.journalIEEE Transactions on Electron Devicesen
dc.eprint.versionFinal published versionen
dc.type.urihttp://purl.org/eprint/type/JournalArticleen
eprint.statushttp://purl.org/eprint/status/PeerRevieweden
dspace.orderedauthorsGomez, Leonardo; Hashemi, Pouya; Hoyt, Judy L.en
mit.licensePUBLISHER_POLICYen
mit.metadata.statusComplete


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