Show simple item record

dc.contributor.authorVerghese, Simon
dc.contributor.authorRuff, Albert C.
dc.contributor.authorBrattain, Michael A.
dc.contributor.authorMcIntosh, K. Alexander
dc.contributor.authorSmith, Gary M.
dc.contributor.authorFunk, Joseph E.
dc.date.accessioned2010-03-17T16:46:22Z
dc.date.available2010-03-17T16:46:22Z
dc.date.issued2009-04
dc.identifier.issn0277-786X
dc.identifier.urihttp://hdl.handle.net/1721.1/52666
dc.description.abstractAvalanche Photodiode (APD) photon counting arrays are finding an increasing role in defense applications in laser radar and optical communications. As these system concepts mature, the need for reliable screening, test, assembly and packaging of these novel devices has become increasingly critical. MIT Lincoln Laboratory has put significant effort into the screening, reliability testing, and packaging of these components. To provide rapid test and measurement of the APD devices under development, several custom parallel measurement and Geiger-mode (Gm) aging systems have been developed. Another challenge is the accurate attachment of the microlens arrays with the APD arrays to maximize the photon detection efficiency. We have developed an active alignment process with single µm precision in all six degrees of freespace alignment. This is suitable for the alignment of arrays with active areas as small as 5 µm. Finally, we will discuss a focal plane array (FPA) packaging qualification effort, to verify that single photon counting FPAs can survive in future airborne systems.en
dc.description.sponsorshipDefense Advanced Research Project Agency (Air Force contract number FA8721-05-C-0002)en
dc.language.isoen_US
dc.publisherThe International Society for Optical Engineeringen
dc.relation.isversionofhttp://dx.doi.org/10.1117/12.821294en
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en
dc.sourceSPIEen
dc.titlePackaging and qualification of single photon counting avalanche photodiode focal plane arraysen
dc.typeArticleen
dc.identifier.citationFunk, Joseph E. et al. “Packaging and qualification of single-photon counting avalanche photodiode focal plane arrays.” Advanced Photon Counting Techniques III. Ed. Mark A. Itzler & Joe C. Campbell. Orlando, FL, USA: SPIE, 2009. 73200S-9. © 2009 SPIE--The International Society for Optical Engineeringen
dc.contributor.departmentLincoln Laboratoryen_US
dc.contributor.approverFunk, Joseph E.
dc.contributor.mitauthorVerghese, Simon
dc.contributor.mitauthorRuff, Albert C.
dc.contributor.mitauthorBrattain, Michael A.
dc.contributor.mitauthorMcIntosh, K. Alexander
dc.contributor.mitauthorSmith, Gary M.
dc.contributor.mitauthorFunk, Joseph E.
dc.relation.journalProceedings of SPIEen
dc.eprint.versionFinal published versionen
dc.type.urihttp://purl.org/eprint/type/JournalArticleen
eprint.statushttp://purl.org/eprint/status/PeerRevieweden
dspace.orderedauthorsFunk, Joseph E.; Smith, Gary M.; McIntosh, K. Alex; Donnelly, Joseph P.; Brattain, Michael A.; Ruff, Albert C.; Verghese, Simonen
mit.licensePUBLISHER_POLICYen


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record