Multiscale imaging of human thyroid pathologies using integrated Optical Coherence Tomography (OCT) and Optical Coherence Microscopy (OCM)
Name
Zhou-2010-Multiscale imaging of human.pdf
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Author(s) • • • • • •
Zhou, Chao
Wong, Yihong
Aguirre, Aaron Dominic
Tsai, Tsung-Han
Cohen, David W.
Connolly, James L.
Fujimoto, James G.
Date Issued
February 2010
Journal
Proceedings of SPIE--the International Society for Optical Engineering; v.7554
Publisher
SPIE
Citation
Zhou, Chao et al. “Multiscale imaging of human thyroid pathologies using integrated optical coherence tomography (OCT) and optical coherence microscopy (OCM).” Optical Coherence Tomography and Coherence Domain Optical Methods in Biomedicine XIV. Ed. Joseph A. Izatt, James G. Fujimoto, & Valery V. Tuchin. San Francisco, California, USA: SPIE, 2010. 755409-8. ©2010 COPYRIGHT SPIE--The International Society for Optical Engineering
Version
Final published version
Abstract
We evaluate the feasibility of optical coherence tomography (OCT) and optical coherence microscopy (OCM) for imaging of benign and malignant thyroid lesions ex vivo using intrinsic optical contrast. Thirty four thyroid gland specimens were imaged from 17 patients, covering a spectrum of pathology, ranging from normal thyroid to neoplasia and benign disease. The integrated OCT and OCM imaging system allows seamlessly switching between low and high magnifications, in a way similar to traditional microscopy. Good correspondence was observed between optical images and histological sections. The results provide a basis for interpretation of future OCT and OCM images of the thyroid tissues and suggest the possibility of future in vivo evaluation of thyroid pathology.
Subjects
Optical coherence tomography (OCT)
Optical coherence microscopy (OCM)
Thyroid
Pathology
Cancer
MIT Department
Harvard University--MIT Division of Health Sciences and Technology
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Research Laboratory of Electronics
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1117/12.843616