| dc.contributor.author | Jin, Donghyun |  | 
| dc.contributor.author | Kim, Dae-Hyun |  | 
| dc.contributor.author | Kim, Tae-Woo |  | 
| dc.contributor.author | del Alamo, Jesus A. |  | 
| dc.date.accessioned | 2010-10-20T12:30:58Z |  | 
| dc.date.available | 2010-10-20T12:30:58Z |  | 
| dc.date.issued | 2010-03 |  | 
| dc.date.submitted | 2009-12 |  | 
| dc.identifier.isbn | 978-1-4244-5639-0 |  | 
| dc.identifier.isbn | 978-1-4244-5640-6 |  | 
| dc.identifier.other | INSPEC Accession Number: 11207425 |  | 
| dc.identifier.uri | http://hdl.handle.net/1721.1/59416 |  | 
| dc.description.abstract | We have built a physical gate capacitance model for III-V FETs that incorporates quantum capacitance and centroid capacitance in the channel. We verified its validity with simulations (Nextnano) and experimental measurements on High Electron Mobility Transistors (HEMTs) with InAs and InGaAs channels down to 30 nm in gate length. Our model confirms that in the operational range of these devices, the quantum capacitance significantly lowers the overall gate capacitance. In addition, the channel centroid capacitance is also found to have a significant impact on gate capacitance. Our model provides a number of suggestions for capacitance scaling in future III-V FETs. | en_US | 
| dc.description.sponsorship | Intel Corporation | en_US | 
| dc.description.sponsorship | Focus Center Research Program. Center for Materials, Structures and Devices | en_US | 
| dc.language.iso | en_US |  | 
| dc.publisher | Institute of Electrical and Electronics Engineers | en_US | 
| dc.relation.isversionof | http://dx.doi.org/10.1109/IEDM.2009.5424312 | en_US | 
| dc.rights | Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. | en_US | 
| dc.source | IEEE | en_US | 
| dc.title | Quantum capacitance in scaled down III-V FETs | en_US | 
| dc.type | Article | en_US | 
| dc.identifier.citation | Donghyun Jin et al. “Quantum capacitance in scaled down III–V FETs.” Electron Devices Meeting (IEDM), 2009 IEEE International. 2009. 1-4. © Copyright 2010 IEEE | en_US | 
| dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | en_US | 
| dc.contributor.department | Massachusetts Institute of Technology. Microsystems Technology Laboratories | en_US | 
| dc.contributor.approver | del Alamo, Jesus A. |  | 
| dc.contributor.mitauthor | Jin, Donghyun |  | 
| dc.contributor.mitauthor | Kim, Dae-Hyun |  | 
| dc.contributor.mitauthor | Kim, Tae-Woo |  | 
| dc.contributor.mitauthor | del Alamo, Jesus A. |  | 
| dc.relation.journal | 2009 IEEE International Electron Devices Meeting (IEDM) | en_US | 
| dc.eprint.version | Final published version | en_US | 
| dc.type.uri | http://purl.org/eprint/type/ConferencePaper | en_US | 
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US | 
| dspace.orderedauthors | Donghyun Jin; Kim, Daehyun; Taewoo Kim, Daehyun; del Alamo, Jesus A. | en | 
| mit.license | PUBLISHER_POLICY | en_US | 
| mit.metadata.status | Complete |  |