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dc.contributor.authorJin, Donghyun
dc.contributor.authorKim, Dae-Hyun
dc.contributor.authorKim, Tae-Woo
dc.contributor.authordel Alamo, Jesus A.
dc.date.accessioned2010-10-20T12:30:58Z
dc.date.available2010-10-20T12:30:58Z
dc.date.issued2010-03
dc.date.submitted2009-12
dc.identifier.isbn978-1-4244-5639-0
dc.identifier.isbn978-1-4244-5640-6
dc.identifier.otherINSPEC Accession Number: 11207425
dc.identifier.urihttp://hdl.handle.net/1721.1/59416
dc.description.abstractWe have built a physical gate capacitance model for III-V FETs that incorporates quantum capacitance and centroid capacitance in the channel. We verified its validity with simulations (Nextnano) and experimental measurements on High Electron Mobility Transistors (HEMTs) with InAs and InGaAs channels down to 30 nm in gate length. Our model confirms that in the operational range of these devices, the quantum capacitance significantly lowers the overall gate capacitance. In addition, the channel centroid capacitance is also found to have a significant impact on gate capacitance. Our model provides a number of suggestions for capacitance scaling in future III-V FETs.en_US
dc.description.sponsorshipIntel Corporationen_US
dc.description.sponsorshipFocus Center Research Program. Center for Materials, Structures and Devicesen_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/IEDM.2009.5424312en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleQuantum capacitance in scaled down III-V FETsen_US
dc.typeArticleen_US
dc.identifier.citationDonghyun Jin et al. “Quantum capacitance in scaled down III–V FETs.” Electron Devices Meeting (IEDM), 2009 IEEE International. 2009. 1-4. © Copyright 2010 IEEEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Microsystems Technology Laboratoriesen_US
dc.contributor.approverdel Alamo, Jesus A.
dc.contributor.mitauthorJin, Donghyun
dc.contributor.mitauthorKim, Dae-Hyun
dc.contributor.mitauthorKim, Tae-Woo
dc.contributor.mitauthordel Alamo, Jesus A.
dc.relation.journal2009 IEEE International Electron Devices Meeting (IEDM)en_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsDonghyun Jin; Kim, Daehyun; Taewoo Kim, Daehyun; del Alamo, Jesus A.en
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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