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dc.contributor.authordel Alamo, Jesus A.
dc.contributor.authorKim, Dae-Hyun
dc.date.accessioned2010-10-22T14:28:02Z
dc.date.available2010-10-22T14:28:02Z
dc.date.issued2009-05
dc.identifier.isbn978-1-4244-3433-6
dc.identifier.isbn978-1-4244-3432-9
dc.identifier.issn1092-8669
dc.identifier.otherINSPEC Accession Number: 10688357
dc.identifier.urihttp://hdl.handle.net/1721.1/59462
dc.description.abstractWe have experimentally investigated the role of thinning down the channel thickness and using high InAs composition as a channel material, which aims to improve the electrostatic integrity of the device as well as high frequency characteristics of the device. To do so, we have fabricated InAs PHEMTs with tch = 10 nm, together with reference In0.7Ga0.3As PHEMTs with tch = 13 nm. In comparison with reference In0.7Ga0.3As ones, InAs PHEMTs with tch = 10 nm exhibit excellent electrostatic integrity of the device down to Lg = 30 nm regime, such as subthreshold swing (S=75 mV/dec), DIBL = 84 mV/V and gm_max = 1.9 mS/mm at VDS = 0.5 V. Besides, InAs PHEMTs with Lg = 30 nm show outstanding fT = 600 GHz and fmax = 490 GHz at VDS = 0.5 V. More importantly, InAs PHEMTs exhibit a far better scaling behaviors, down to Lg = 30 nm regimes. Indeed, InAs is a promising choice of the channel material for future THz and logic applications.en_US
dc.description.sponsorshipIntel Corporationen_US
dc.description.sponsorshipSemiconductor Research Corporation. Focus Center Research Programen_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/ICIPRM.2009.5012459en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleScalability of sub-100 nm thin-channel InAs PHEMTsen_US
dc.typeArticleen_US
dc.identifier.citationDae-Hyun Kim, and J.A. del Alamo. “Scalability of sub-100 nm thin-channel InAs PHEMTs.” Indium Phosphide & Related Materials, 2009. IPRM '09. IEEE International Conference on. 2009. 132-135. © 2009 Institute of Electrical and Electronics Engineers.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Microsystems Technology Laboratoriesen_US
dc.contributor.approverdel Alamo, Jesus A.
dc.contributor.mitauthordel Alamo, Jesus A.
dc.contributor.mitauthorKim, Dae-Hyun
dc.relation.journalIEEE International Conference on Indium Phosphide & Related Materials, 2009. IPRM '09en_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsKim, Dae-Hyun; del Alamo, Jesus A.en
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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