| dc.contributor.author | Schmidt, Martin Arnold | |
| dc.contributor.author | Lam, Eric Wing-Jing | |
| dc.contributor.author | Li, Hanqing | |
| dc.date.accessioned | 2010-10-26T18:14:27Z | |
| dc.date.available | 2010-10-26T18:14:27Z | |
| dc.date.issued | 2009-10 | |
| dc.date.submitted | 2009-06 | |
| dc.identifier.isbn | 978-1-4244-4193-8 | |
| dc.identifier.isbn | 978-1-4244-4190-7 | |
| dc.identifier.other | INSPEC Accession Number: 10917082 | |
| dc.identifier.uri | http://hdl.handle.net/1721.1/59526 | |
| dc.description.abstract | We report a new surface micromachining process using commercial silver nanoparticle inks and digital fabrication methods. This process is entirely digital (non-lithographic patterning), the feature sizes can be <20 mum, and the maximum temperature is less than 250degC. Furthermore, we have completed materials property characterization in order to enable design in this process. As a demonstration, silver cantilevers were fabricated using this process and subsequently characterized to determine the silver film's mechanical properties. | en_US |
| dc.description.sponsorship | United States. Defense Advanced Research Projects Agency (N/MEMS Fundamentals Program) | en_US |
| dc.description.sponsorship | Hewlett-Packard Company | en_US |
| dc.language.iso | en_US | |
| dc.publisher | Institute of Electrical and Electronics Engineers | en_US |
| dc.relation.isversionof | http://dx.doi.org/10.1109/SENSOR.2009.5285759 | en_US |
| dc.rights | Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. | en_US |
| dc.source | IEEE | en_US |
| dc.subject | MEMS | en_US |
| dc.subject | Inkjet | en_US |
| dc.subject | Nanoparticles | en_US |
| dc.subject | Printing | en_US |
| dc.title | Silver nanoparticle structures realized by digital surface micromachining | en_US |
| dc.type | Article | en_US |
| dc.identifier.citation | Lam, E.W., H. Li, and M.A. Schmidt. “Silver nanoparticle structures realized by digital surface micromachining.” Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International. 2009. 1698-1701. ©2009 Institute of Electrical and Electronics Engineers. | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Microsystems Technology Laboratories | en_US |
| dc.contributor.approver | Schmidt, Martin Arnold | |
| dc.contributor.mitauthor | Schmidt, Martin Arnold | |
| dc.contributor.mitauthor | Lam, Eric Wing-Jing | |
| dc.contributor.mitauthor | Li, Hanqing | |
| dc.relation.journal | International Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009 | en_US |
| dc.eprint.version | Final published version | en_US |
| dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
| dspace.orderedauthors | Lam, E.W.; Li, H.; Schmidt, M.A. | en |
| dc.identifier.orcid | https://orcid.org/0000-0002-0828-2220 | |
| dc.identifier.orcid | https://orcid.org/0000-0001-7322-7490 | |
| mit.license | PUBLISHER_POLICY | en_US |
| mit.metadata.status | Complete | |
