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Photonic integration in a commercial scaled bulk-CMOS process

Author(s)
Kaertner, Franz X.; Orcutt, Jason Scott; Khilo, Anatol M.; Popovic, M. A.; Holzwarth, Charles W.; Li, Hanqing; Sun, J.; Moss, Benjamin Roy; Dahlem, Marcus Vinicius Sobral; Ippen, Erich P.; Hoyt, Judy L.; Stojanovic, Vladimir Marko; Smith, Henry Ignatius; Ram, Rajeev J.; ... Show more Show less
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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Abstract
We demonstrate the first photonic chip designed for a commercial bulk CMOS process (65 nm-node) using standard process layers combined with post-processing, enabling dense photonic integration with high-performance microprocessor electronics.
Date issued
2009-11
URI
http://hdl.handle.net/1721.1/60061
Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science; Massachusetts Institute of Technology. Research Laboratory of Electronics
Journal
International Conference on Photonics in Switching, 2009. PS '09
Publisher
Institute of Electrical and Electronics Engineers
Citation
Orcutt, J.S. et al. “Photonic integration in a commercial scaled bulk-CMOS process.” Photonics in Switching, 2009. PS '09. International Conference on. 2009. 1-2. © 2009 IEEE.
Version: Final published version
Other identifiers
INSPEC Accession Number: 10963482
ISBN
978-1-4244-3857-0

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