Elastic averaging for assembly of three-dimensional constructs from elastomeric micromolded layers
Author(s)
Vacanti, Joseph P.; Hsiao, James C.; Borenstein, Jeffrey T.; Marentis, Theodore C.
DownloadMarentis-2009-Elastic averaging for assembly of three-dimensional constructs from elastomeric micromolded layers.pdf (752.0Kb)
PUBLISHER_POLICY
Publisher Policy
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Terms of use
Metadata
Show full item recordAbstract
Precision engineering has been used in the macroworld and in the microscale only with rigid materials. Soft flexible materials commonly used for microfluidics and other bio-MEMS applications have not been aligned with elastic averaging. We report the use of complementary raised and recessed circular features to align polymer layers and demonstrate alignment accuracy and repeatability. The alignment is accomplished in a Petri dish with a thin layer of liquid between the two surfaces of micromolded elastomeric polymer sheets. The layers are aligned with simple hand-eye manipulation. We test circular geometries of varying diameters, obtaining accuracy and repeatability values in the range of 1-3 mum across thin polymer sheets molded from silicon masters. This is a significant improvement over existing manual, moving stage, and self-alignment techniques and a novel proof of concept that paves the way for complex 3-D polymer constructs.
Date issued
2009-06Department
Harvard University--MIT Division of Health Sciences and Technology; Massachusetts Institute of Technology. Department of Biological Engineering; Massachusetts Institute of Technology. Department of Chemical EngineeringJournal
Journal of Microelectromechanical Systems
Publisher
Institute of Electrical and Electronics Engineers
Citation
Marentis, T.C. et al. “Elastic Averaging for Assembly of Three-Dimensional Constructs From Elastomeric Micromolded Layers.” Microelectromechanical Systems, Journal of 18.3 (2009): 531-538. ©2009 IEEE.
Version: Final published version
Other identifiers
INSPEC Accession Number: 10712731
ISSN
1057-7157