Show simple item record

dc.contributor.authorThompson, Carl V.
dc.contributor.authorSasangka, W. A.
dc.contributor.authorGan, Chee Lip
dc.contributor.authorChoi, W. K.
dc.contributor.authorWei, J.
dc.date.accessioned2010-12-17T16:26:31Z
dc.date.available2010-12-17T16:26:31Z
dc.date.issued2010-02
dc.date.submitted2009-12
dc.identifier.isbn978-1-4244-5100-5
dc.identifier.isbn978-1-4244-5099-2
dc.identifier.otherINSPEC Accession Number: 11141084
dc.identifier.urihttp://hdl.handle.net/1721.1/60303
dc.description.abstractIn the present study, the interaction between thin film Cu and non-eutectic Sn-In is studied. The effects of the bonding and aging temperature on microstructure, IMC formation and also shear strength are investigated by SEM/EDX, XRD and shear testing. The bonding mechanism is proposed based on the obtained results. The bonding mechanism is proposed to occur over 2 stages: (1) An increase in bonding temperatures leads to an increase in the true contact area, and (2) The aging temperature leads to interdiffusion and assists formation of the IMC. The type of IMC that forms is à ¿ phase (Cu6(Sn, In)5) which is similar to the interaction between Cu and eutectic Sn-In. The shear strength increases with increasing the bonding temperature. On the other hand, the aging temperature does not have a significant impact on the shear strength. This indicates that the shear strength is mostly affected by the true contact area rather than the IMC formation.en_US
dc.description.sponsorshipSingapore-MIT Allianceen_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/EPTC.2009.5416527en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleEffect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In soldersen_US
dc.typeArticleen_US
dc.identifier.citationSasangka, W.A. et al. “Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In solders.” Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. 2009. 336-341. ©2010 IEEE.en_US
dc.contributor.departmentMIT Materials Research Laboratoryen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.approverThompson, Carl V.
dc.contributor.mitauthorThompson, Carl V.
dc.relation.journal11th Electronics Packaging Technology Conference, 2009. EPTC '09en_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
dspace.orderedauthorsSasangka, W.A.; Gan, C.L.; Thompson, C.V.; Choi, W.K.; Wei, J.en
dc.identifier.orcidhttps://orcid.org/0000-0002-0121-8285
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record