Electroactive hydrodynamic weirs for microparticle manipulation and patterning
Author(s)Taff, Brian M.; Desai, Salil P.; Voldman, Joel
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We present a platform for parallelized manipulations of individual polarizable micron-scale particles (i.e., microparticles) that combines negative dielectrophoretic forcing with the passive capture of hydrodynamic weir-based trapping. Our work enables manipulations using ejection- and/or exclusion-based methods. In ejection operations, we unload targeted weirs by displacing microparticles from their capture faces via electrode activation. In exclusion-based operations, we prevent weir loading by activating selected on-chip electrodes before introducing microparticles into the system. Our work describes the device’s passive loading dynamics and demonstrates enhanced functionalities by forming a variety of particle patterns.
DepartmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Applied Physical Letters
American Institute of Physics
Taff, Brian M., Salil P. Desai, and Joel Voldman. “Electroactive hydrodynamic weirs for microparticle manipulation and patterning.” Applied Physics Letters 94.8 (2009): 084102-3. © 2009 American Institute of Physics.
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