Show simple item record

dc.contributor.authorEl-Moselhy, Tarek Ali
dc.contributor.authorElfadel, Ibrahim M.
dc.contributor.authorDaniel, Luca
dc.date.accessioned2012-02-01T20:15:24Z
dc.date.available2012-02-01T20:15:24Z
dc.date.issued2011-01
dc.date.submitted2010-10
dc.identifier.issn1521-3323
dc.identifier.issn1557-9980
dc.identifier.urihttp://hdl.handle.net/1721.1/68998
dc.description.abstractIn this paper, we propose a hierarchical algorithm to compute the 3-D capacitances of a large number of topologically different layout configurations that are all assembled from the same basic layout motifs. Our algorithm uses the boundary element method in order to compute a Markov transition matrix (MTM) for each motif. The individual motifs are connected together by building a large Markov chain. Such Markov chain can be simulated extremely efficiently using Monte Carlo simulations (e.g., random walks). The main practical advantage of the proposed algorithm is its ability to extract the capacitance of a large number of layout configurations in a complexity that is basically independent of the number of configurations. For instance, in a large 3-D layout example, the capacitance calculation of 1000 different configurations assembled from the same motifs is accomplished in the time required to solve independently two configurations, i.e., a 500 × speedup.en_US
dc.description.sponsorshipMentor Graphics (Firm)en_US
dc.description.sponsorshipAdvanced Micro Devices (Firm)en_US
dc.description.sponsorshipInternational Business Machines Corporationen_US
dc.description.sponsorshipSemiconductor Research Corporationen_US
dc.description.sponsorshipInterconnect Focus Center (United States. Defense Advanced Research Projects Agency and Semiconductor Research Corporation)en_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/tadvp.2010.2091504en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleA Markov Chain Based Hierarchical Algorithm for Fabric-Aware Capacitance Extractionen_US
dc.typeArticleen_US
dc.identifier.citationEl-Moselhy, T, I M Elfadel, and L Daniel. “A Markov Chain Based Hierarchical Algorithm for Fabric-Aware Capacitance Extraction.” IEEE Transactions on Advanced Packaging 33.4 (2010): 818-827. Web. 1 Feb. 2012. © 2011 Institute of Electrical and Electronics Engineersen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Aeronautics and Astronauticsen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverDaniel, Luca
dc.contributor.mitauthorEl-Moselhy, Tarek Ali
dc.contributor.mitauthorElfadel, Ibrahim M.
dc.contributor.mitauthorDaniel, Luca
dc.relation.journalIEEE Transactions on Advanced Packagingen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsEl-Moselhy, T; Elfadel, I M; Daniel, Len
dc.identifier.orcidhttps://orcid.org/0000-0002-5880-3151
dspace.mitauthor.errortrue
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record