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dc.contributor.authorFranke, Oliver
dc.contributor.authorTrenkle, Jonathan C.
dc.contributor.authorSchuh, Christopher A.
dc.date.accessioned2012-03-28T20:58:46Z
dc.date.available2012-03-28T20:58:46Z
dc.date.issued2010-07
dc.date.submitted2010-01
dc.identifier.issn0884-2914
dc.identifier.issn2044-5326
dc.identifier.urihttp://hdl.handle.net/1721.1/69887
dc.description.abstractThe influence of temperature on the indentation size effect is explored experimentally. Copper is indented on a custom-built high-temperature nanoindenter at temperatures between ambient and 200 °C, in an inert atmosphere that precludes oxidation. Over this range of temperatures, the size effect is reduced considerably, suggesting that thermal activation plays a major role in determining the length scale for plasticity.en_US
dc.description.sponsorshipUnited States. Army Research Office (Institute for Soldier Nanotechnologies at MIT)en_US
dc.language.isoen_US
dc.publisherCambridge University Press/Materials Research Societyen_US
dc.relation.isversionofhttp://dx.doi.org/10.1557/jmr.2010.0159en_US
dc.rightsCreative Commons Attribution-Noncommercial-Share Alike 3.0en_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/3.0/en_US
dc.sourceProf. Schuh via Angie Locknaren_US
dc.titleTemperature dependence of the indentation size effecten_US
dc.typeArticleen_US
dc.identifier.citationFranke, Oliver, Jonathan C. Trenkle, and Christopher A. Schuh. “Temperature Dependence of the Indentation Size Effect.” Journal of Materials Research 25.07 (2011): 1225–1229.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.approverSchuh, Christopher A.
dc.contributor.mitauthorSchuh, Christopher A.
dc.contributor.mitauthorFranke, Oliver
dc.contributor.mitauthorTrenkle, Jonathan C.
dc.relation.journalJournal of Materials Researchen_US
dc.eprint.versionAuthor's final manuscripten_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsFranke, Oliver; Trenkle, Jonathan C.; Schuh, Christopher A.en
dc.identifier.orcidhttps://orcid.org/0000-0001-9856-2682
mit.licenseOPEN_ACCESS_POLICYen_US
mit.metadata.statusComplete


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