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dc.contributor.authorWeinstein, Dana
dc.contributor.authorBhave, Sunil A.
dc.date.accessioned2012-07-25T15:51:01Z
dc.date.available2012-07-25T15:51:01Z
dc.date.issued2009-12
dc.date.submitted2009-08
dc.identifier.issn1057-7157
dc.identifier.issn1941-0158
dc.identifier.urihttp://hdl.handle.net/1721.1/71800
dc.description.abstractThis paper investigates electrostatic transduction of a longitudinal-mode silicon acoustic resonator with internal dielectric films. Geometric optimization of internal dielectrically transduced resonators is derived analytically and shown experimentally. Analysis of internal dielectric transduction shows a maximum transduction efficiency with thin dielectric films at points of maximum strain of the desired resonant mode. With this design optimization, a silicon bar resonator is realized with a ninth harmonic resonance of 4.5 GHz and a quality factor of over 11 000, resulting in a record high f middotQ product in silicon of 5.1 times 10[superscript 13]. The novel dielectric transducer demonstrates improved resonator performance with increasing frequency, with optimal transduction efficiency when the acoustic wavelength is twice the dielectric thickness. Such frequency scaling behavior enables the realization of resonators up to the super-high-frequency domain.en_US
dc.description.sponsorshipNational Defense Science and Engineeringen_US
dc.description.sponsorshipU.S. Army Research Laboratoryen_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/jmems.2009.2032480en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleInternal Dielectric Transduction in Bulk-Mode Resonatorsen_US
dc.typeArticleen_US
dc.identifier.citationWeinstein, D., and S.A. Bhave. “Internal Dielectric Transduction in Bulk-Mode Resonators.” Journal of Microelectromechanical Systems 18.6 (2009): 1401–1408. © Copyright 2009 IEEEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverWeinstein, Dana
dc.contributor.mitauthorWeinstein, Dana
dc.contributor.mitauthorBhave, Sunil A.
dc.relation.journalJournal of Microelectromechanical Systemsen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsWeinstein, D.; Bhave, S.A.en
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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