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An integrated organic circuit array for flexible large-area temperature sensing

dc.contributor.authorHe, David Da
dc.contributor.authorNausieda, Ivan A.
dc.contributor.authorRyu, Kevin K.
dc.contributor.authorAkinwande, Akintunde Ibitayo
dc.contributor.authorBulovic, Vladimir
dc.contributor.authorSodini, Charles G.
dc.date.accessioned2012-08-09T19:02:33Z
dc.date.available2012-08-09T19:02:33Z
dc.date.issued2010-02
dc.identifier.isbn978-1-4244-6033-5
dc.identifier.issn0193-6530
dc.identifier.otherINSPEC Accession Number: 11204909
dc.identifier.urihttp://hdl.handle.net/1721.1/72077
dc.description.abstractAn integrated organic temperature-sensing circuit array compatible with flexible and large-area substrates is presented. The array outputs an average value of 6.8 mV/A[over-carat][degree symbol]C, which is 22A[over-tilde] more responsive than the MOSFET implementation while dissipating 90 nW/cell. Highly linear outputs enable two-point calibrations that remove the effects of cell-to-cell variation.en_US
dc.description.sponsorshipSemiconductor Research Corporation. Focus Center Research Program for Center for Circuits and Systems Solutions (C2S2) (contract 2003-CT-888)en_US
dc.description.sponsorshipNatural Sciences and Engineering Research Council of Canada (NSERC)en_US
dc.description.sponsorshipHewlett-Packard Companyen_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/ISSCC.2010.5434013en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleAn integrated organic circuit array for flexible large-area temperature sensingen_US
dc.typeArticleen_US
dc.identifier.citationHe, David Da et al. “An Integrated Organic Circuit Array for Flexible Large-area Temperature Sensing.” IEEE International Solid-State Circuits Conference, Digest of Technical Papers (ISSCC), IEEE, 2010. 142–143. Web. ©2010 IEEE.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Microsystems Technology Laboratoriesen_US
dc.contributor.approverAkinwande, Akintunde Ibitayo
dc.contributor.mitauthorAkinwande, Akintunde Ibitayo
dc.contributor.mitauthorHe, David Da
dc.contributor.mitauthorNausieda, Ivan A.
dc.contributor.mitauthorRyu, Kevin K.
dc.contributor.mitauthorBulovic, Vladimir
dc.contributor.mitauthorSodini, Charles G.
dc.relation.journalIEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2010en_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
dspace.orderedauthorsHe, David Da; Nausieda, Ivan A.; Ryu, Kyungbum Kevin; Akinwande, Akintunde I.; Bulovic, Vladimir; Sodini, Charles G.en
dc.identifier.orcidhttps://orcid.org/0000-0003-3001-9223
dc.identifier.orcidhttps://orcid.org/0000-0002-0960-2580
dc.identifier.orcidhttps://orcid.org/0000-0002-0413-8774
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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