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dc.contributor.authorChen, Xiangyu
dc.contributor.authorAkinwande, Deji
dc.contributor.authorLee, Kyeong-Jae
dc.contributor.authorClose, Gael F.
dc.contributor.authorYasuda, Shinichi
dc.contributor.authorPaul, Bipul C.
dc.contributor.authorFujita, Shinobu
dc.contributor.authorKong, Jing
dc.contributor.authorWong, H. -S. Philip
dc.date.accessioned2012-08-14T18:49:04Z
dc.date.available2012-08-14T18:49:04Z
dc.date.issued2010-09
dc.date.submitted2010-07
dc.identifier.issn0018-9383
dc.identifier.urihttp://hdl.handle.net/1721.1/72125
dc.description.abstractCarbon-based nanomaterials such as metallic single-walled carbon nanotubes, multiwalled carbon nanotubes (MWCNTs), and graphene have been considered as some of the most promising candidates for future interconnect technology because of their high current-carrying capacity and conductivity in the nanoscale, and immunity to electromigration, which has been a great challenge for scaling down the traditional copper interconnects. Therefore, studies on the performance and optimization of carbon-based interconnects working in a realistic operational environment are needed in order to advance the technology beyond the exploratory discovery phase. In this paper, we present the first demonstration of graphene interconnects monolithically integrated with industry-standard complementary metal-oxide-semiconductor technology, as well as the first experimental results that compare the performance of high-speed on-chip graphene and MWCNT interconnects. The graphene interconnects operate up to 1.3-GHz frequency, which is a speed that is commensurate with the fastest high-speed processor chips today. A low-swing signaling technique has been applied to improve the speed of carbon interconnects up to 30%.en_US
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/TED.2010.2069562en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceIEEEen_US
dc.titleFully Integrated Graphene and Carbon Nanotube Interconnects for Gigahertz High-Speed Cmos Electronicsen_US
dc.typeArticleen_US
dc.identifier.citationChen, Xiangyu et al. “Fully Integrated Graphene and Carbon Nanotube Interconnects for Gigahertz High-Speed CMOS Electronics.” IEEE Transactions on Electron Devices 57.11 (2010): 3137–3143. © Copyright 2010 IEEEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.approverKong, Jing
dc.contributor.mitauthorLee, Kyeong-Jae
dc.contributor.mitauthorKong, Jing
dc.relation.journalIEEE Transactions on Electron Devicesen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsChen, Xiangyu; Akinwande, Deji; Lee, Kyeong-Jae; Close, Gael F.; Yasuda, Shinichi; Paul, Bipul C.; Fujita, Shinobu; Kong, Jing; Wong, H.-S. Philipen
dc.identifier.orcidhttps://orcid.org/0000-0003-0551-1208
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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