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A 110μW 10Mb/s eTextiles Transceiver for Body Area Networks with Remote Batter Power

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dc.contributor.author Mercier, Patrick Philip
dc.contributor.author Chandrakasan, Anantha P.
dc.date.accessioned 2012-08-17T19:35:33Z
dc.date.available 2012-08-17T19:35:33Z
dc.date.issued 2010-02
dc.date.submitted 2010-02
dc.identifier.isbn 978-1-4244-6033-5
dc.identifier.issn 0193-6530
dc.identifier.uri http://hdl.handle.net/1721.1/72199
dc.description.abstract A transceiver for communicating over an electronic textiles medium is implemented for body area networks. A supply-rail-coupled differential signaling scheme permits time-sharing of the eTextiles medium between communication and remote powering circuits. Fabricated in 0.18 μm CMOS and operating at 0.9 V, the chip consumes 110 μW at a data rate of 10 Mb/s over a 1 m fabric link. en_US
dc.description.sponsorship Focus Center Research Program. Focus Center for Circuit & System Solutions (C2S2) (Contract number 2003-CT-888) en_US
dc.language.iso en_US
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en_US
dc.relation.isversionof http://dx.doi.org/10.1109/ISSCC.2010.5433868 en_US
dc.rights Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. en_US
dc.source IEEE en_US
dc.title A 110μW 10Mb/s eTextiles Transceiver for Body Area Networks with Remote Batter Power en_US
dc.type Article en_US
dc.identifier.citation Mercier, Patrick P., and Anantha P. Chandrakasan. “A 110μW 10Mb/s eTextiles Transceiver for Body Area Networks with Remote Batter Power.” 2010 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2010. 496–497. © Copyright 2010 IEEE en_US
dc.contributor.department Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science en_US
dc.contributor.approver Chandrakasan, Anantha P.
dc.contributor.mitauthor Mercier, Patrick Philip
dc.contributor.mitauthor Chandrakasan, Anantha P.
dc.relation.journal 2010 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) en_US
dc.identifier.mitlicense PUBLISHER_POLICY en_US
dc.eprint.version Final published version en_US
dc.type.uri http://purl.org/eprint/type/ConferencePaper en_US
dspace.orderedauthors Mercier, Patrick P.; Chandrakasan, Anantha P. en
dc.identifier.orcid https://orcid.org/0000-0002-5977-2748


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