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dc.contributor.authorKao, Justin C. T.
dc.contributor.authorHosoi, Anette E.
dc.date.accessioned2013-04-24T20:38:38Z
dc.date.available2013-04-24T20:38:38Z
dc.date.issued2012-04
dc.date.submitted2011-11
dc.identifier.issn1070-6631
dc.identifier.issn1089-7666
dc.identifier.urihttp://hdl.handle.net/1721.1/78595
dc.description.abstractWe examine Landau-Levich coating by a suspension of spherical particles. For particles larger than the liquid film thickness, capillary forces lead to self-assembly of monolayer particle aggregates. We observe two regimes of deposition, find coating fraction as a function of wall speed, and propose a spinodal decomposition (Cahn-Hilliard) model for this pattern formation process.en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Grant DMS-0803083)en_US
dc.language.isoen_US
dc.publisherAmerican Institute of Physics (AIP)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1063/1.3700970en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceMIT web domainen_US
dc.titleSpinodal decomposition in particle-laden Landau-Levich flowen_US
dc.typeArticleen_US
dc.identifier.citationKao, Justin C. T., and A. E. Hosoi. “Spinodal Decomposition in Particle-laden Landau-Levich Flow.” Physics of Fluids 24.4 (2012): 041701. ©2012 American Institute of Physicsen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Earth, Atmospheric, and Planetary Sciencesen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.mitauthorKao, Justin C. T.
dc.contributor.mitauthorHosoi, Anette E.
dc.relation.journalPhysics of Fluidsen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsKao, Justin C. T.; Hosoi, A. E.en
dc.identifier.orcidhttps://orcid.org/0000-0003-4940-7496
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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