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Modeling and implementation of solder-activated joints for single-actuator, centimeter-scale robotic mechanisms

Author(s)
Telleria, Maria J.; Hansen, Malik; Campbell, Don; Servi, Amelia T.; Culpepper, Martin Luther
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Abstract
We explain when, and why, solder-based phase change materials (PCMs) are best-suited as a means to modify a robotic mechanism's kinematic and elastomechanic behavior. The preceding refers to mechanisms that possess joints which may be thermally locked and unlocked via a material phase change within the joint. Different combinations of locked and unlocked joints can yield several one-DOF mechanisms states. One actuator may be used to control motion allowed by a first state, then a new combination of locked/unlocked joints may be set and the actuator then controls motion allowed by the new state. Compared to other thermo-rheological fluids, solders yield joints with the (i) highest strength and stiffness, (ii) fastest lock/unlock speed, and (iii) lowest lock/unlock power. Herein, we cover physics-based design insights that provide understanding of how solder-based material properties and joint design dominate/limit joint performance characteristics. First order models are used to demonstrate selection of suitable PCMs and how to set initial joint geometry prior to fine tuning via detailed models/experiments. The insights and models are discussed in the context of a joint for a crawling robot that uses a single spooler motor and three solder-locking joints to crawl and steer.
Date issued
2010-05
URI
http://hdl.handle.net/1721.1/78616
Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Journal
IEEE International Conference on Robotics and Automation (ICRA), 2010
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Telleria, Maria J, Malik Hansen, Don Campbell, Amelia Servi, and Martin L Culpepper. Modeling and Implementation of Solder-activated Joints for Single-actuator, Centimeter-scale Robotic Mechanisms. In Pp. 1681–1686, 2010. © Copyright 2010 IEEE
Version: Final published version
ISBN
978-1-4244-5040-4
978-1-4244-5038-1
ISSN
1050-4729

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