Co-polymer clad design for high performance athermal photonic circuits

Abstract

Ubiquitous, low power consumption and high bandwidth density communication will require passive athermal optical filters for WDM transceivers in Si-CMOS architecture. Two silicon-polymer composite structures, deposited using initiated chemical vapor deposition (iCVD), poly(perfluorodecyl acrylate) (pPFDA) and poly(perfluorodecyl acrylate-co-divinyl benzene) p(PFDA-co-DVB), are analyzed as candidates for thermal compensation. The addition of DVB to a fluorinated acrylate backbone reduces the C-F bond density, increases the density in the copolymer and thereby increases refractive index. The addition of DVB also increases the volume expansion coefficient of the copolymer, resulting in an increased thermo-optic (TO) coefficient for the copolymer system. The increased index and TO coefficient of the co-polymer gives improved bend loss, footprint and FSR performance for athermal silicon photonic circuits.