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dc.contributor.authorJohnson, Jeremy A.
dc.contributor.authorMaznev, Alexei
dc.contributor.authorEliason, Jeffrey Kristian
dc.contributor.authorMinnich, Austin Jerome
dc.contributor.authorCollins, Kimberlee C.
dc.contributor.authorChen, Gang
dc.contributor.authorCuffe, John
dc.contributor.authorKehoe, Timothy
dc.contributor.authorSotomayor Torres, Clivia M.
dc.contributor.authorNelson, Keith Adam
dc.date.accessioned2013-11-26T20:14:01Z
dc.date.available2013-11-26T20:14:01Z
dc.date.issued2011-08
dc.identifier.issn1946-4274
dc.identifier.urihttp://hdl.handle.net/1721.1/82598
dc.description.abstractThe length-scales at which thermal transport crosses from the diffusive to ballistic regime are of much interest particularly in the design and improvement of nano-structured materials. In this work, we demonstrate that the departure from diffusive transport has been observed in Si and GaAs using an optical transient thermal grating technique where an arbitrary, experimentally set length scale can be imposed on a material. In a transient thermal grating experiment, crossed laser pulses interfere creating a well-defined periodic absorption and temperature profile. A probe beam is diffracted from this transient grating and length-scale dependent thermal transport properties can be determined from the signal decay. As the length scale is decreased to lengths shorter than the mean free paths of heat carrying phonons, quasi-ballistic heat transport effects become apparent allowing us to map out length scales and mean free paths relevant to nondiffusive thermal transport in Si and GaAs.en_US
dc.description.sponsorshipUnited States. Dept. of Energy. Office of Basic Energy Science (Solar-Thermal Energy Conversion Center (S3TEC), Award No. DE-SC0001299/DE-FG02-09ER46577)en_US
dc.description.sponsorshipSeventh Framework Programme (European Commission) (NANOPOWER, contract number 256959)en_US
dc.description.sponsorshipOpenAIRE (TAILPHOX, contract number 233883)en_US
dc.description.sponsorshipEuropean Commission (NANOFUNCTION, contract number 257375)en_US
dc.description.sponsorshipAcphin Health Ltd. (ACPHIN, contract number FIS2009-150)en_US
dc.description.sponsorshipCatalonia (Spain). Agencia de Gestio d'Ajuts Universitaris i de Recerca (AGAUR, 2009-SGR-150)en_US
dc.language.isoen_US
dc.publisherCambridge University Press/Materials Research Societyen_US
dc.relation.isversionofhttp://dx.doi.org/10.1557/opl.2011.1333en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceMIT web domainen_US
dc.titleExperimental Evidence of Non-Diffusive Thermal Transport in Si and GaAsen_US
dc.typeArticleen_US
dc.identifier.citationJohnson, Jeremy A., Alexei A. Maznev, Jeffrey K. Eliason, Austin Minnich, Kimberlee Collins, Gang Chen, John Cuffe, Timothy Kehoe, Clivia M. Sotomayor Torres, and Keith A. Nelson. “Experimental Evidence of Non-Diffusive Thermal Transport in Si and GaAs.” MRS Proceedings 1347 (January 23, 2011).© 2011 Materials Research Society.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Chemistryen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.mitauthorJohnson, Jeremy A.en_US
dc.contributor.mitauthorMaznev, Alexeien_US
dc.contributor.mitauthorEliason, Jeffrey Kristianen_US
dc.contributor.mitauthorMinnich, Austin Jeromeen_US
dc.contributor.mitauthorCollins, Kimberlee C.en_US
dc.contributor.mitauthorChen, Gangen_US
dc.contributor.mitauthorNelson, Keith Adamen_US
dc.relation.journalMRS Proceedingsen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsJohnson, Jeremy A.; Maznev, Alexei A.; Eliason, Jeffrey K.; Minnich, Austin; Collins, Kimberlee; Chen, Gang; Cuffe, John; Kehoe, Timothy; Sotomayor Torres, Clivia M.; Nelson, Keith A.en_US
dc.identifier.orcidhttps://orcid.org/0000-0002-3968-8530
dc.identifier.orcidhttps://orcid.org/0000-0001-7804-5418
dspace.mitauthor.errortrue
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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