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dc.contributor.authorWillner, Dana
dc.contributor.authorHugenholtz, Philip
dc.contributor.authorRabaey, Korneel
dc.contributor.authorBuie, Cullen R.
dc.contributor.authorBraff, William
dc.date.accessioned2014-01-06T19:25:00Z
dc.date.available2014-01-06T19:25:00Z
dc.date.issued2013-10
dc.date.submitted2013-03
dc.identifier.issn1932-6203
dc.identifier.urihttp://hdl.handle.net/1721.1/83513
dc.description.abstractInsulator-based dielectrophoresis can be used to manipulate biological particles, but has thus far found limited practical applications due to low sensitivity. We present linear sweep three-dimensional insulator-based dielectrophoresis as a considerably more sensitive approach for strain-level discrimination bacteria. In this work, linear sweep three-dimensional insulator-based dielectrophoresis was performed on Pseudomonas aeruginosa PA14 along with six isogenic mutants as well as Streptococcus mitis SF100 and PS344. Strain-level discrimination was achieved between these clinically important pathogens with applied electric fields below 10 V/mm. This low voltage, high sensitivity technique has potential applications in clinical diagnostics as well as microbial physiology research.en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Award 1150615)en_US
dc.description.sponsorshipMISTI Hayashi Seed Funden_US
dc.language.isoen_US
dc.publisherPublic Library of Scienceen_US
dc.relation.isversionofhttp://dx.doi.org/10.1371/journal.pone.0076751en_US
dc.rights.urihttp://creativecommons.org/licenses/by/2.5/en_US
dc.sourcePLoSen_US
dc.titleDielectrophoresis-Based Discrimination of Bacteria at the Strain Level Based on Their Surface Propertiesen_US
dc.typeArticleen_US
dc.identifier.citationBraff, William A., Dana Willner, Philip Hugenholtz, Korneel Rabaey, and Cullen R. Buie. “Dielectrophoresis-Based Discrimination of Bacteria at the Strain Level Based on Their Surface Properties.” Edited by Arum Han. PLoS ONE 8, no. 10 (October 16, 2013): e76751.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.mitauthorBraff, Williamen_US
dc.contributor.mitauthorBuie, Cullen R.en_US
dc.relation.journalPLoS ONEen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsBraff, William A.; Willner, Dana; Hugenholtz, Philip; Rabaey, Korneel; Buie, Cullen R.en_US
dc.identifier.orcidhttps://orcid.org/0000-0002-2275-4570
dc.identifier.orcidhttps://orcid.org/0000-0001-9529-2912
mit.licensePUBLISHER_CCen_US
mit.metadata.statusComplete


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