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dc.contributor.authorTian, Zhiting
dc.contributor.authorLee, Sangyeop
dc.contributor.authorChen, Gang
dc.date.accessioned2014-01-13T19:56:37Z
dc.date.available2014-01-13T19:56:37Z
dc.date.issued2013-05
dc.date.submitted2013-01
dc.identifier.issn0022-1481
dc.identifier.urihttp://hdl.handle.net/1721.1/83924
dc.description.abstractSolid-state thermoelectric devices are currently used in applications ranging from thermocouple sensors to power generators in space missions, to portable air-conditioners and refrigerators. With the ever-rising demand throughout the world for energy consumption and CO[subscript 2] reduction, thermoelectric energy conversion has been receiving intensified attention as a potential candidate for waste-heat harvesting as well as for power generation from renewable sources. Efficient thermoelectric energy conversion critically depends on the performance of thermoelectric materials and devices. In this review, we discuss heat transfer in thermoelectric materials and devices, especially phonon engineering to reduce the lattice thermal conductivity of thermoelectric materials, which requires a fundamental understanding of nanoscale heat conduction physics.en_US
dc.description.sponsorshipUnited States. Dept. of Energy. Office of Basic Energy Sciences (Award DE-FG02-09ER46577)en_US
dc.description.sponsorshipUnited States. Multidisciplinary University Research Initiative (Award RF01224242)en_US
dc.language.isoen_US
dc.publisherASME Internationalen_US
dc.relation.isversionofhttp://dx.doi.org/10.1115/1.4023585en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceZhiting Tianen_US
dc.titleHeat Transfer in Thermoelectric Materials and Devicesen_US
dc.typeArticleen_US
dc.identifier.citationTian, Zhiting, Sangyeop Lee, and Gang Chen. “Heat Transfer in Thermoelectric Materials and Devices.” Journal of Heat Transfer 135, no. 6 (June 1, 2013): 061605. Copyright © 2013 by ASMEen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.approverChen, Gangen_US
dc.contributor.mitauthorTian, Zhitingen_US
dc.contributor.mitauthorLee, Sangyeopen_US
dc.contributor.mitauthorChen, Gangen_US
dc.relation.journalJournal of Heat Transferen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsTian, Zhiting; Lee, Sangyeop; Chen, Gangen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-3968-8530
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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