| dc.contributor.author | Tian, Zhiting | |
| dc.contributor.author | Lee, Sangyeop | |
| dc.contributor.author | Chen, Gang | |
| dc.date.accessioned | 2014-01-13T19:56:37Z | |
| dc.date.available | 2014-01-13T19:56:37Z | |
| dc.date.issued | 2013-05 | |
| dc.date.submitted | 2013-01 | |
| dc.identifier.issn | 0022-1481 | |
| dc.identifier.uri | http://hdl.handle.net/1721.1/83924 | |
| dc.description.abstract | Solid-state thermoelectric devices are currently used in applications ranging from thermocouple sensors to power generators in space missions, to portable air-conditioners and refrigerators. With the ever-rising demand throughout the world for energy consumption and CO[subscript 2] reduction, thermoelectric energy conversion has been receiving intensified attention as a potential candidate for waste-heat harvesting as well as for power generation from renewable sources. Efficient thermoelectric energy conversion critically depends on the performance of thermoelectric materials and devices. In this review, we discuss heat transfer in thermoelectric materials and devices, especially phonon engineering to reduce the lattice thermal conductivity of thermoelectric materials, which requires a fundamental understanding of nanoscale heat conduction physics. | en_US |
| dc.description.sponsorship | United States. Dept. of Energy. Office of Basic Energy Sciences (Award DE-FG02-09ER46577) | en_US |
| dc.description.sponsorship | United States. Multidisciplinary University Research Initiative (Award RF01224242) | en_US |
| dc.language.iso | en_US | |
| dc.publisher | ASME International | en_US |
| dc.relation.isversionof | http://dx.doi.org/10.1115/1.4023585 | en_US |
| dc.rights | Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. | en_US |
| dc.source | Zhiting Tian | en_US |
| dc.title | Heat Transfer in Thermoelectric Materials and Devices | en_US |
| dc.type | Article | en_US |
| dc.identifier.citation | Tian, Zhiting, Sangyeop Lee, and Gang Chen. “Heat Transfer in Thermoelectric Materials and Devices.” Journal of Heat Transfer 135, no. 6 (June 1, 2013): 061605. Copyright © 2013 by ASME | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Mechanical Engineering | en_US |
| dc.contributor.approver | Chen, Gang | en_US |
| dc.contributor.mitauthor | Tian, Zhiting | en_US |
| dc.contributor.mitauthor | Lee, Sangyeop | en_US |
| dc.contributor.mitauthor | Chen, Gang | en_US |
| dc.relation.journal | Journal of Heat Transfer | en_US |
| dc.eprint.version | Final published version | en_US |
| dc.type.uri | http://purl.org/eprint/type/JournalArticle | en_US |
| eprint.status | http://purl.org/eprint/status/PeerReviewed | en_US |
| dspace.orderedauthors | Tian, Zhiting; Lee, Sangyeop; Chen, Gang | en_US |
| dc.identifier.orcid | https://orcid.org/0000-0002-3968-8530 | |
| mit.license | PUBLISHER_POLICY | en_US |
| mit.metadata.status | Complete | |