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dc.contributor.authorXu, Guoqiang
dc.contributor.authorDemkowicz, Michael J.
dc.date.accessioned2014-02-18T17:41:06Z
dc.date.available2014-02-18T17:41:06Z
dc.date.issued2013-10
dc.date.submitted2013-05
dc.identifier.issn0031-9007
dc.identifier.issn1079-7114
dc.identifier.urihttp://hdl.handle.net/1721.1/84982
dc.description.abstractWe present a new mechanism—discovered using molecular dynamics simulations—that leads to complete healing of nanocracks. This mechanism relies on the generation of crystal defects known as disclinations by migrating grain boundaries. Crack healing by disclinations does not require any compressive loads applied normal to the crack faces and even occurs under monotonic tensile loading. By closing small cracks and suppressing the propagation of others, this mechanism may provide a novel way of mitigating internal damage that influences ductility in nanocrystalline metals.en_US
dc.description.sponsorshipBP-MIT Materials and Corrosion Centeren_US
dc.language.isoen_US
dc.publisherAmerican Physical Societyen_US
dc.relation.isversionofhttp://dx.doi.org/10.1103/PhysRevLett.111.145501en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceAmerican Physical Societyen_US
dc.titleHealing of Nanocracks by Disclinationsen_US
dc.typeArticleen_US
dc.identifier.citationXu, G. Q., and M. J. Demkowicz. “Healing of Nanocracks by Disclinations.” Physical Review Letters 111, no. 14 (October 2013). © 2013 American Physical Societyen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.mitauthorXu, Guoqiangen_US
dc.contributor.mitauthorDemkowicz, Michael J.en_US
dc.relation.journalPhysical Review Lettersen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsXu, G. Q.; Demkowicz, M. J.en_US
dc.identifier.orcidhttps://orcid.org/0000-0002-9276-7772
dc.identifier.orcidhttps://orcid.org/0000-0003-3949-0441
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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